Inventor · disambiguated record
Shi Qi Huang
Also filed as: HUANG SHI QI
9 granted patents·1 pending application·18 citations·filing 2019–2025
83Inventor score
Files withYANGTZE MEMORY TECH CO LTD10
Top patents by PatentIndex Score
10 records- 0190US10748851B1Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 18, 2020·6 cites·20 claims
- 0289US11462503B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 0388US11205619B2Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·9 claims
- 0487US11094714B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
- 0582US11049834B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
- 0682US2025301651A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0777US11348936B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted May 31, 2022·2 cites·20 claims
- 0872US12402309B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 26, 2025·0 cites·20 claims
- 0952US11342352B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted May 24, 2022·0 cites·20 claims
- 1052US11270770B2Local word line driver device, memory device, and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →