Inventor · disambiguated record
Frank Yantis Lowe
Also filed as: LOWE FRANK · LOWE FRANK YANTIS
13 granted patents·6 pending applications·813 citations·filing 1999–2023
92Inventor score
Files withRFHIC CORP8ALIEN TECHNOLOGY CORP5AKASH SYSTEMS INC2ELEMENT SIX TECHNOLOGIES US CORP1FRANCIS DANIEL1
Top patents by PatentIndex Score
19 records- 0198US6623579B1Methods and apparatus for fluidic self assemblyALIEN TECHNOLOGY CORP·Filed 1999·Granted Sep 23, 2003·271 cites·15 claims
- 0298US6479395B1Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openingsALIEN TECHNOLOGY CORP·Filed 1999·Granted Nov 12, 2002·265 cites·29 claims
- 0397US7531218B2Methods and apparatuses for fluidic self assemblyALIEN TECHNOLOGY CORP·Filed 2006·Granted May 12, 2009·60 cites·17 claims
- 0496US7172789B2Methods and apparatus for fluidic self assemblyALIEN TECHNOLOGY CORP·Filed 2003·Granted Feb 6, 2007·107 cites·6 claims
- 0595US7101502B2Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openingsALIEN TECHNOLOGY CORP·Filed 2002·Granted Sep 5, 2006·90 cites·28 claims
- 0688US9359693B2Gallium-nitride-on-diamond wafers and manufacturing equipment and methods of manufactureELEMENT SIX TECHNOLOGIES US CORP·Filed 2013·Granted Jun 7, 2016·17 cites·5 claims
- 0776US11404300B2Mounting of semiconductor-on-diamond wafers for device processingRFHIC CORP·Filed 2020·Granted Aug 2, 2022·1 cites·16 claims
- 0863US9882007B2Handle for semiconductor-on-diamond wafers and method of manufactureRFHIC CORP·Filed 2013·Granted Jan 30, 2018·2 cites·16 claims
- 0960US10699896B2Methods for fabricating semiconductor devices that have polycrystalline CVD diamondRFHIC CORP·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 1057US10446468B2Method of fabricating compound semiconductor device structures having polycrstalline CVD diamondRFHIC CORP·Filed 2019·Granted Oct 15, 2019·0 cites·16 claims
- 1156US2024170362A1Devices having and methods of forming thermally conductive substratesAKASH SYSTEMS INC·Filed 2023·Application pending·0 cites
- 1255US2023420333A1Substrate features in thermally conductive materialsAKASH SYSTEMS INC·Filed 2023·Application pending·0 cites
- 1351US10319580B2Compound semiconductor device structures comprising polycrystalline CVD diamondRFHIC CORP·Filed 2015·Granted Jun 11, 2019·0 cites·18 claims
- 1448US10586850B2Handle for semiconductor-on-diamond wafers and method of manufactureRFHIC CORP·Filed 2017·Granted Mar 10, 2020·0 cites·22 claims
- 1547US2006249873A1Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openingsSMITH JOHN S·Filed 2006·Application pending·0 cites
- 1647US2015161837A1Methods and systems for providing control of a device using a fingerprint sensorSMITH JOHN STEPHEN·Filed 2013·Application pending·0 cites
- 1745US10297526B2Compound semiconductor device structures comprising polycrystalline CVD diamondRFHIC CORP·Filed 2015·Granted May 21, 2019·0 cites·17 claims
- 1843US2018315637A1Mounting of semiconductor-on-diamond wafers for device processingRFHIC CORP·Filed 2016·Application pending·0 cites
- 1938US2015279945A1Semiconductor devices with improved reliability and operating life and methods of manufactuirng the sameFRANCIS DANIEL·Filed 2013·Application pending·0 cites
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