Inventor · disambiguated record
Sudipta K. Ray
Also filed as: RAY SUDIPTA K · RAY SUDIPTA KUMAR
51 granted patents·2,508 citations·filing 1981–2012
99Inventor score
Top patents by PatentIndex Score
51 records- 0199US6258625B1Method of interconnecting electronic components using a plurality of conductive studsIBM·Filed 1999·Granted Jul 10, 2001·243 cites·14 claims
- 0296US5209817ASelective plating method for forming integral via and wiring layersIBM·Filed 1991·Granted May 11, 1993·297 cites·10 claims
- 0395US6270363B1Z-axis compressible polymer with fine metal matrix suspensionIBM·Filed 1999·Granted Aug 7, 2001·105 cites·24 claims
- 0494US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0594US5130779ASolder mass having conductive encapsulating arrangementIBM·Filed 1990·Granted Jul 14, 1992·185 cites·47 claims
- 0693US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0793US5436412AInterconnect structure having improved metallizationIBM·Filed 1993·Granted Jul 25, 1995·148 cites·30 claims
- 0892US5251806AMethod of forming dual height solder interconnectionsIBM·Filed 1992·Granted Oct 12, 1993·144 cites·48 claims
- 0992US4489364AChip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surfaceIBM·Filed 1981·Granted Dec 18, 1984·87 cites·6 claims
- 1091US7806341B2Structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2009·Granted Oct 5, 2010·16 cites·26 claims
- 1191US7281667B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2005·Granted Oct 16, 2007·18 cites·4 claims
- 1291US6502999B1Opto-electronic transceiver module and hermetically sealed housing thereforeJDS UNIPHASE CORP·Filed 2001·Granted Jan 7, 2003·55 cites·18 claims
- 1390US8227918B2Robust FBEOL and UBM structure of C4 interconnectsLU MINHUA·Filed 2009·Granted Jul 24, 2012·21 cites·4 claims
- 1489US6878608B2Method of manufacture of silicon based packageIBM·Filed 2001·Granted Apr 12, 2005·54 cites·16 claims
- 1589US5796169AStructurally reinforced ball grid array semiconductor package and systemsIBM·Filed 1996·Granted Aug 18, 1998·112 cites·23 claims
- 1688US6429388B1High density column grid array connections and method thereofIBM·Filed 2000·Granted Aug 6, 2002·53 cites·14 claims
- 1788US6184062B1Process for forming cone shaped solder for chip interconnectionIBM·Filed 1999·Granted Feb 6, 2001·56 cites·71 claims
- 1887US6335210B1Baseplate for chip burn-in and/of testing, and method thereofIBM·Filed 1999·Granted Jan 1, 2002·64 cites·13 claims
- 1986US8466543B2Three dimensional stacked package structureFLEISCHMAN THOMAS J·Filed 2010·Granted Jun 18, 2013·13 cites·25 claims
- 2085US7472836B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2007·Granted Jan 6, 2009·11 cites·5 claims
- 2185US6559527B2Process for forming cone shaped solder for chip interconnectionIBM·Filed 2001·Granted May 6, 2003·28 cites·20 claims
- 2285US4463059ALayered metal film structures for LSI chip carriers adapted for solder bonding and wire bondingIBM·Filed 1982·Granted Jul 31, 1984·60 cites·11 claims
- 2384US6235996B1Interconnection structure and process module assembly and reworkIBM·Filed 1998·Granted May 22, 2001·65 cites·35 claims
- 2482US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 2580US8450849B2Robust FBEOL and UBM structure of C4 interconnectsLU MINHUA·Filed 2012·Granted May 28, 2013·5 cites·24 claims
- 2676US6762119B2Method of preventing solder wetting in an optical device using diffusion of CrINTERNAT BUSSINESS MACHINES CO·Filed 2001·Granted Jul 13, 2004·23 cites·18 claims
- 2776US6395991B1Column grid array substrate attachment with heat sink stress reliefIBM·Filed 1996·Granted May 28, 2002·54 cites·14 claims
- 2876US4985310AMultilayered metallurgical structure for an electronic componentIBM·Filed 1989·Granted Jan 15, 1991·51 cites·16 claims
- 2974US6574859B2Interconnection process for module assembly and reworkIBM·Filed 2001·Granted Jun 10, 2003·18 cites·25 claims
- 3073US6784086B2Lead-free solder structure and method for high fatigue lifeIBM·Filed 2001·Granted Aug 31, 2004·16 cites·35 claims
- 3170US6259155B1Polymer enhanced column grid arrayIBM·Filed 1999·Granted Jul 10, 2001·31 cites·22 claims
- 3269US6713686B2Apparatus and method for repairing electronic packagesIBM·Filed 2002·Granted Mar 30, 2004·16 cites·20 claims
- 3369US6220499B1Method for assembling a chip carrier to a semiconductor deviceIBM·Filed 1998·Granted Apr 24, 2001·30 cites·7 claims
- 3469US6053394AColumn grid array substrate attachment with heat sink stress reliefIBM·Filed 1998·Granted Apr 25, 2000·39 cites·10 claims
- 3568US6548909B2Method of interconnecting electronic components using a plurality of conductive studsIBM·Filed 2001·Granted Apr 15, 2003·11 cites·12 claims
- 3668US6216937B1Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 1999·Granted Apr 17, 2001·31 cites·12 claims
- 3768US5153408AMethod and structure for repairing electrical linesIBM·Filed 1990·Granted Oct 6, 1992·33 cites·44 claims
- 3867US6360938B2Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 2001·Granted Mar 26, 2002·12 cites·12 claims
- 3966US6984792B2Dielectric interposer for chip to substrate solderingIBM·Filed 2003·Granted Jan 10, 2006·9 cites·14 claims
- 4064US8304290B2Overcoming laminate warpage and misalignment in flip-chip packagesGRAF RICHARD S·Filed 2009·Granted Nov 6, 2012·3 cites·25 claims
- 4164US5243140ADirect distribution repair and engineering change systemIBM·Filed 1991·Granted Sep 7, 1993·33 cites·13 claims
- 4262US6350625B1Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereofIBM·Filed 2000·Granted Feb 26, 2002·6 cites·35 claims
- 4356US5543584AStructure for repairing electrical linesIBM·Filed 1992·Granted Aug 6, 1996·21 cites·24 claims
- 4455US6015955AReworkability solution for wirebound chips using high performance capacitorIBM·Filed 1997·Granted Jan 18, 2000·13 cites·11 claims
- 4550US6827505B2Optoelectronic package structure and process for planar passive optical and optoelectronic devicesIBM·Filed 2002·Granted Dec 7, 2004·4 cites·20 claims
- 4646US6908025B2Preparing MCM hat for removalIBM·Filed 2003·Granted Jun 21, 2005·1 cites·20 claims
- 4745US9433105B2Method of fabricating printed circuit boardsGRAF RICHARD STEPHEN·Filed 2009·Granted Aug 30, 2016·0 cites·13 claims
- 4844US5961032AMethod of fabrication of a multi-component solder column by blocking a portion of a through hole in a moldIBM·Filed 1997·Granted Oct 5, 1999·12 cites·6 claims
- 4939US6657313B1Dielectric interposer for chip to substrate solderingIBM·Filed 1999·Granted Dec 2, 2003·7 cites·12 claims
- 5038US4576659AProcess for inhibiting metal migration during heat cycling of multilayer thin metal film structuresIBM·Filed 1982·Granted Mar 18, 1986·9 cites·10 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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