Inventor · disambiguated record
Cliff C. Lee
Also filed as: LEE CLIFF · LEE CLIFF C
4 granted patents·4 pending applications·6 citations·filing 2005–2023
63Inventor score
Top patents by PatentIndex Score
8 records- 0189US12027361B2High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronicsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Jul 2, 2024·2 cites·20 claims
- 0272US8674235B2Microelectronic substrate for alternate package functionalityHOSSAIN MD ALTAF·Filed 2011·Granted Mar 18, 2014·4 cites·13 claims
- 0356US2025201645A1Fabricating packages with dummy dies having a construction that mimics warpage of the other components included in the packageMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 0447US9961769B2Microelectronic substrate for alternate package functionalityINTEL CORP·Filed 2014·Granted May 1, 2018·0 cites·7 claims
- 0546US2022344240A1Multilayer superconducting structures for cryogenic electronicsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Application pending·0 cites
- 0642US2008150122A1Routing density through asymmetric array of viasLEE CLIFF·Filed 2006·Application pending·0 cites
- 0736US7356796B2Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfacesINTEL CORP·Filed 2005·Granted Apr 8, 2008·0 cites·16 claims
- 0832US2018005972A1Interface structures for packaged circuitry and method of providing sameINTEL CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →