Inventor · disambiguated record
Leocadio Morona Alabin
Also filed as: ALABIN LEOCADIO · ALABIN LEOCADIO M · ALABIN LEOCADIO MORONA
17 granted patents·7 pending applications·201 citations·filing 2003–2011
93Inventor score
Files withFAIRCHILD SEMICONDUCTOR8GALERA MANOLITO7AMKOR TECHNOLOGY INC3GALERA MANOLITO FABRES3ALABIN LEOCADIO M1
Top patents by PatentIndex Score
24 records- 0194US7008825B1Leadframe strip having enhanced testabilityAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 7, 2006·114 cites·21 claims
- 0286US8053883B2Isolated stacked die semiconductor packagesFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Nov 8, 2011·7 cites·20 claims
- 0381US7846773B2Multi-chip semiconductor packageFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Dec 7, 2010·9 cites·16 claims
- 0480US6847099B1Offset etched corner leads for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·32 cites·21 claims
- 0574US7923847B2Semiconductor system-in-a-package containing micro-layered lead frameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Apr 12, 2011·6 cites·25 claims
- 0671US7960211B2Semiconductor system-in-package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 14, 2011·4 cites·24 claims
- 0769US7888781B2Micro-layered lead frame semiconductor packagesFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Feb 15, 2011·4 cites·20 claims
- 0868US8314480B2Stackable semiconductor package with embedded die in pre-molded carrier frameGALERA MANOLITO FABRES·Filed 2010·Granted Nov 20, 2012·4 cites·20 claims
- 0968US8198132B2Isolated stacked die semiconductor packagesGALERA MANOLITO·Filed 2011·Granted Jun 12, 2012·2 cites·20 claims
- 1067US7498665B2Integrated circuit leadless package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 3, 2009·3 cites·20 claims
- 1165US7977776B2Multichip discrete packageFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Jul 12, 2011·3 cites·18 claims
- 1265US7843048B2Multi-chip discrete devices in semiconductor packagesFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Nov 30, 2010·3 cites·25 claims
- 1362US7944031B2Leadframe-based chip scale semiconductor packagesFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted May 17, 2011·2 cites·25 claims
- 1459US8072051B2Folded lands and vias for multichip semiconductor packagesGALERA MANOLITO·Filed 2009·Granted Dec 6, 2011·2 cites·24 claims
- 1553US7598598B1Offset etched corner leads for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 6, 2009·6 cites·20 claims
- 1649US2010019362A1Isolated stacked die semiconductor packagesGALERA MANOLITO·Filed 2008·Application pending·0 cites
- 1744US2010276793A1High pin density semiconductor system-in-a-packageGALERA MANOLITO·Filed 2009·Application pending·0 cites
- 1843US2010127380A1Leadframe free leadless array semiconductor packagesGALERA MANOLITO·Filed 2008·Application pending·0 cites
- 1943US2010127375A1Wafer level chip scale semiconductor packagesGALERA MANOLITO·Filed 2008·Application pending·0 cites
- 2042US2010308461A1Multi-chip semiconductor packageGALERA MANOLITO·Filed 2010·Application pending·0 cites
- 2140US2010140773A1Stacked chip, micro-layered lead frame semiconductor packageGALERA MANOLITO FABRES·Filed 2008·Application pending·0 cites
- 2233US8268671B2Semiconductor system-in-package and methods for making the sameGALERA MONOLITO FABRES·Filed 2011·Granted Sep 18, 2012·0 cites·20 claims
- 2330US8274145B2Semiconductor package system with patterned mask over thermal reliefALABIN LEOCADIO M·Filed 2007·Granted Sep 25, 2012·0 cites·20 claims
- 2430US2011163428A1Semiconductor packages with embedded heat sinkGALERA MANOLITO FABRES·Filed 2010·Application pending·0 cites
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