Inventor · disambiguated record
Emi Ushioda
Also filed as: USHIODA EMI
2 granted patents·1 pending application·5 citations·filing 2011–2019
42Inventor score
Top patents by PatentIndex Score
3 records- 0170US9017563B2Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquidUSHIODA EMI·Filed 2012·Granted Apr 28, 2015·5 cites·8 claims
- 0252US2022133459A1Protective patch application auxiliary tool and protective patch application method using the sameTOKUYAMA CORP·Filed 2019·Application pending·0 cites
- 0344US9462698B2Metallized substrate, metal paste composition, and method for manufacturing metallized substrateTAKAHASHI NAOTO·Filed 2011·Granted Oct 4, 2016·0 cites·11 claims
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