Inventor · disambiguated record
Tae-Gyeong Chung
Also filed as: CHUNG TAE-GYEONG
21 granted patents·7 pending applications·457 citations·filing 1995–2016
96Inventor score
Top patents by PatentIndex Score
28 records- 0197US8736035B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·26 cites·18 claims
- 0296US6982487B2Wafer level package and multi-package stackSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 3, 2006·145 cites·35 claims
- 0395US8022555B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 20, 2011·34 cites·19 claims
- 0490US7485955B2Semiconductor package having step type die and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·30 cites·6 claims
- 0590US7335592B2Wafer level package, multi-package stack, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 26, 2008·20 cites·9 claims
- 0687US8421244B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2010·Granted Apr 16, 2013·7 cites·32 claims
- 0786US7368811B2Multi-chip package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 6, 2008·16 cites·23 claims
- 0884US6857470B2Stacked chip package with heat transfer wiresSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 22, 2005·38 cites·20 claims
- 0978US9484292B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2014·Granted Nov 1, 2016·3 cites·15 claims
- 1072US5894107AChip-size package (CSP) using a multi-layer laminated lead frameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 13, 1999·47 cites·9 claims
- 1171US6812578B2Semiconductor device bonding pad resistant to stress and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 2, 2004·18 cites·15 claims
- 1269US9685400B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2016·Granted Jun 20, 2017·1 cites·20 claims
- 1368US8115324B2Semiconductor moduleKANG SUN-WON·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 1467US6340838B1Apparatus and method for containing semiconductor chips to identify known good diesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 22, 2002·33 cites·13 claims
- 1562US8129221B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2011·Granted Mar 6, 2012·1 cites·10 claims
- 1661US8431442B2Methods of manufacturing semiconductor chipsPARK SANG WOOK·Filed 2011·Granted Apr 30, 2013·1 cites·20 claims
- 1759US5660318AApparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Aug 26, 1997·29 cites·12 claims
- 1858US7821139B2Flip-chip assembly and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 26, 2010·1 cites·8 claims
- 1953US7923291B2Method of fabricating electronic device having stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 12, 2011·0 cites·19 claims
- 2051US6943438B2Memory card having a control chipSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 13, 2005·4 cites·8 claims
- 2149US8928154B2Semiconductor moduleKANG SUN-WON·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 2246US2008173999A1Stack package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2343US2008268579A1Semiconductor chip package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2443US2009278561A1Probe card having redistributed wiring probe needle structure and probe card module using the sameJO CHA-JEA·Filed 2008·Application pending·0 cites
- 2536US2012326307A1Stacked semiconductor deviceJEONG SE-YOUNG·Filed 2012·Application pending·0 cites
- 2636US2014339290A1Wire bonding method and semiconductor package manufactured using the sameHAN WON-GIL·Filed 2014·Application pending·0 cites
- 2736US2002119595A1Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
- 2832US2014208850A1Apparatus and method of detecting a defect of a semiconductor deviceKIM GEUN-WOO·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →