Inventor · disambiguated record
Tzu-Yu Wang
Also filed as: WANG TZU-YU
53 granted patents·14 pending applications·551 citations·filing 2001–2024
98Inventor score
Files withHONEYWELL INT INC25FINISAR CORP10TAIWAN SEMICONDUCTOR MFG CO LTD9TOP RANK TECH LIMITED5TAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
67 records- 0198US9128123B2Interposer test structures and methodsLIU TZUAN-HORNG·Filed 2011·Granted Sep 8, 2015·31 cites·20 claims
- 0298US7564887B2Long wavelength vertical cavity surface emitting lasersFINISAR CORP·Filed 2005·Granted Jul 21, 2009·60 cites·23 claims
- 0397US9589857B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·8 cites·20 claims
- 0492US7031363B2Long wavelength VCSEL device processingFINISAR CORP·Filed 2003·Granted Apr 18, 2006·39 cites·24 claims
- 0591US10090213B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·20 claims
- 0691US10056347B2Bump structure for yield improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·21 claims
- 0791US8741234B2Disposable cartridge for fluid analysisWANG TZU-YU·Filed 2011·Granted Jun 3, 2014·21 cites·21 claims
- 0889US8354750B2Stress buffer structures in a mounting structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 15, 2013·9 cites·16 claims
- 0989US7517201B2Asymmetric dual diaphragm pumpHONEYWELL INT INC·Filed 2005·Granted Apr 14, 2009·13 cites·16 claims
- 1089US6798806B1Hybrid mirror VCSELsFINISAR CORP·Filed 2002·Granted Sep 28, 2004·24 cites·20 claims
- 1188US6813293B2Long wavelength VCSEL with tunnel junction, and implantFINISAR CORP·Filed 2002·Granted Nov 2, 2004·25 cites·63 claims
- 1287US8007704B2Insert molded actuator componentsHONEYWELL INT INC·Filed 2006·Granted Aug 30, 2011·15 cites·26 claims
- 1387US6606199B2Graded thickness optical element and method of manufacture thereforHONEYWELL INT INC·Filed 2001·Granted Aug 12, 2003·36 cites·15 claims
- 1486US7216048B2Calibrated pressure sensorHONEYWELL INT INC·Filed 2004·Granted May 8, 2007·30 cites·11 claims
- 1585US9337118B2Stress buffer structures in a mounting structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·5 cites·12 claims
- 1684US8906798B2Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 9, 2014·5 cites·20 claims
- 1783US7054345B2Enhanced lateral oxidationFINISAR CORP·Filed 2003·Granted May 30, 2006·20 cites·7 claims
- 1881US9372951B2Semiconductor device design methods and conductive bump pattern enhancement methodsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 21, 2016·4 cites·21 claims
- 1981US7168675B2Media isolated electrostatically actuated valveHONEYWELL INT INC·Filed 2004·Granted Jan 30, 2007·22 cites·35 claims
- 2080US6693934B2Wavelength division multiplexed vertical cavity surface emitting laser arrayHONEYWELL INT INC·Filed 2001·Granted Feb 17, 2004·16 cites·29 claims
- 2179US8741233B2Disposable cartridge for fluid analysisBARDELL RON·Filed 2011·Granted Jun 3, 2014·10 cites·9 claims
- 2279US8693163B2Cylindrical embedded capacitorsSU AN-JHIH·Filed 2010·Granted Apr 8, 2014·6 cites·15 claims
- 2379US7546772B2Piezoresistive pressure sensorHONEYWELL INT INC·Filed 2004·Granted Jun 16, 2009·20 cites·27 claims
- 2478US7328882B2Microfluidic modulating valveHONEYWELL INT INC·Filed 2005·Granted Feb 12, 2008·8 cites·37 claims
- 2577US8294264B2Radiate under-bump metallization structure for semiconductor devicesWANG TZU-YU·Filed 2010·Granted Oct 23, 2012·5 cites·12 claims
- 2674US11682593B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·20 claims
- 2773US7286584B2Carrier bonded 1550 nm VCSEL with InP substrate removalFINISAR CORP·Filed 2004·Granted Oct 23, 2007·11 cites·13 claims
- 2872US7877862B2Weldless mesotube grid holderHONEYWELL INT INC·Filed 2007·Granted Feb 1, 2011·2 cites·18 claims
- 2972US7433381B2InP based long wavelength VCSELFINISAR CORP·Filed 2003·Granted Oct 7, 2008·11 cites·8 claims
- 3072US7183143B2Method for forming nitrided tunnel oxide layerMACRONIX INT CO LTD·Filed 2003·Granted Feb 27, 2007·16 cites·7 claims
- 3170US9691840B2Cylindrical embedded capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 27, 2017·2 cites·20 claims
- 3268US11274957B2Method to calibrate disposable cartridge cuvette thickness in-situHONEYWELL INT INC·Filed 2018·Granted Mar 15, 2022·0 cites·16 claims
- 3366US6901807B1Positive and negative pressure sensorHONEYWELL INT INC·Filed 2004·Granted Jun 7, 2005·12 cites·13 claims
- 3466US6886410B1Modified dual diaphragm pressure sensorHONEYWELL INT INC·Filed 2003·Granted May 3, 2005·12 cites·20 claims
- 3565US10734295B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 3665US9037279B2Clustering for prediction models in process control and for optimal dispatchingKO FRANCIS·Filed 2010·Granted May 19, 2015·1 cites·20 claims
- 3765US7222639B2Electrostatically actuated gas valveHONEYWELL INT INC·Filed 2004·Granted May 29, 2007·12 cites·39 claims
- 3864US8896089B2Interposers for semiconductor devices and methods of manufacture thereofCHIU TZU-WEI·Filed 2011·Granted Nov 25, 2014·2 cites·20 claims
- 3964US7110427B2Hybrid mirror VCSELFINISAR CORP·Filed 2004·Granted Sep 19, 2006·5 cites·27 claims
- 4064US6991213B2Dual diaphragm valveHONEYWELL INT INC·Filed 2004·Granted Jan 31, 2006·11 cites·14 claims
- 4161US9553053B2Bump structure for yield improvementCHIU TZU-WEI·Filed 2012·Granted Jan 24, 2017·1 cites·21 claims
- 4261US7331239B1Self calibrating dual diaphragm pressure sensorHONEYWELL INT INC·Filed 2006·Granted Feb 19, 2008·5 cites·20 claims
- 4361US2025323338A1Liquid-cooling heat dissipation plate and the lithium battery module containing the sameTOP RANK TECH LIMITED·Filed 2024·Application pending·0 cites
- 4460US10139263B2Method to calibrate disposable cartridge cuvette thickness in-situHONEYWELL INT INC·Filed 2013·Granted Nov 27, 2018·0 cites·11 claims
- 4560US8878182B2Probe pad design for 3DIC package yield analysisWANG TZU-YU·Filed 2011·Granted Nov 4, 2014·1 cites·18 claims
- 4660US7467779B2Microfluidic modulating valveHONEYWELL INT INC·Filed 2007·Granted Dec 23, 2008·1 cites·20 claims
- 4755US9588505B2Near non-adaptive virtual metrology and chamber controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 7, 2017·0 cites·20 claims
- 4855US2025324539A1Liquid cooling heat dissipation systemTOP RANK TECH LIMITED·Filed 2024·Application pending·0 cites
- 4954US12504236B2Liquid cooling vapor chamber heat dissipation moduleTOP RANK TECH LIMITED·Filed 2024·Granted Dec 23, 2025·0 cites·14 claims
- 5054US10054938B2Clustering for prediction models in process control and for optimal dispatchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 21, 2018·0 cites·20 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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