Inventor · disambiguated record
Young-Shin Choi
Also filed as: CHOI YOUNG-SHIN
3 granted patents·3 pending applications·2 citations·filing 2007–2019
50Inventor score
Top patents by PatentIndex Score
6 records- 0160US7759795B2Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·15 claims
- 0256US2009141275A1Alignment inspection method and alignment inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0345US2008122081A1Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0440US2008017968A1Stack type semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0537US8149404B2Method for aligning wafer and alignment apparatus using the methodCHOI YOUNG-SHIN·Filed 2009·Granted Apr 3, 2012·0 cites·16 claims
- 0635US10966360B2Apparatus for combining printed circuit boardsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
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