Inventor · disambiguated record

Mei Qi Tay

Also filed as: TAY MEI QI

2 granted patents·1 pending application·0 citations·filing 2020–2024

24Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0157US12027436B2Package with clip having through hole accommodating component-related structureINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
0255US2025054842A1Package with concave wettability and/or metallization layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
0344US11355429B2Electrical interconnect structure with radial spokes for improved solder void controlINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·0 cites·10 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →