Inventor · disambiguated record
Tianwei Sun
Also filed as: SUN TIANWEI
7 granted patents·12 citations·filing 2015–2021
75Inventor score
Top patents by PatentIndex Score
7 records- 0196US11128268B1Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted Sep 21, 2021·10 cites·20 claims
- 0290US11616040B2Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methodsNXP USA INC·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
- 0355US10923451B2Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methodsNXP USA INC·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 0455US9893156B2Segmented field plate structureNXP USA INC·Filed 2017·Granted Feb 13, 2018·0 cites·19 claims
- 0551US9647075B2Segmented field plate structureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 9, 2017·0 cites·17 claims
- 0644US11417335B2Method and device for information processing, terminal, server and storage mediumBEIJING XIAOMI PINECONE ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·15 claims
- 0735US11798545B2Speech interaction method and apparatus, device and storage mediumBEIJING XIAOMI PINECONE ELECTRONICS CO LTD·Filed 2020·Granted Oct 24, 2023·0 cites·14 claims
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