Inventor · disambiguated record
Laurene Yip
Also filed as: YIP LAURENE
2 granted patents·1 pending application·32 citations·filing 2008–2023
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0190US7906857B1Molded integrated circuit package and method of forming a molded integrated circuit packageXILINX INC·Filed 2008·Granted Mar 15, 2011·30 cites·18 claims
- 0257US8410604B2Lead-free structures in a semiconductor deviceYIP LAURENE·Filed 2010·Granted Apr 2, 2013·2 cites·18 claims
- 0355US2025210568A1Redistribution layer structure for high-density semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →