Inventor · disambiguated record
Verena Muhr
Also filed as: MUHR VERENA
1 granted patent·2 pending applications·0 citations·filing 2020–2024
6Inventor score
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0164US2025100088A1Solder material, layer structure, and method of forming a layer structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0244US11328935B2Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 0342US2020381314A1Method for Providing Coated Leadframes or for Measuring an Adhesion Force of an Encapsulant on a LeadframeINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
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