Inventor · disambiguated record
Jun Amako
Also filed as: AMAKO JUN
49 granted patents·11 pending applications·1,314 citations·filing 1993–2013
98Inventor score
Top patents by PatentIndex Score
60 records- 0198US7157661B2Method and apparatus for laser machiningSEIKO EPSON CORP·Filed 2005·Granted Jan 2, 2007·46 cites·12 claims
- 0298US6031201ALaser machining apparatus with rotatable phase gratingSEIKO EPSON CORP·Filed 1997·Granted Feb 29, 2000·189 cites·5 claims
- 0397US7755718B2Optical element, liquid crystal device, and displaySEIKO EPSON CORP·Filed 2008·Granted Jul 13, 2010·35 cites·13 claims
- 0496US6812549B2Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Nov 2, 2004·157 cites·1 claims
- 0596US6635850B2Laser machining method for precision machiningSEIKO EPSON CORP·Filed 2002·Granted Oct 21, 2003·76 cites·14 claims
- 0694US7722194B2Optical element having a reflected light diffusing function and a polarization separation function and a projection display deviceSEIKO EPSON CORP·Filed 2008·Granted May 25, 2010·35 cites·20 claims
- 0793US5682214AOptical apparatus for controlling the wavefront of a coherent lightSEIKO EPSON CORP·Filed 1995·Granted Oct 28, 1997·126 cites·8 claims
- 0892US7972017B2Optical element having a diffractive layer and a relief pattern with concave and convex portionsSEIKO EPSON CORP·Filed 2010·Granted Jul 5, 2011·13 cites·5 claims
- 0992US7944544B2Liquid crystal device having a diffraction function layer that includes a flat portion and a non-flat portion with a grid disposed in the non-flat portionSEIKO EPSON CORP·Filed 2008·Granted May 17, 2011·15 cites·19 claims
- 1091US6563079B1Method for machining work by laser beamSEIKO EPSON CORP·Filed 2000·Granted May 13, 2003·72 cites·17 claims
- 1191US5589955AOptical device and optical machining system using the optical deviceSEIKO EPSON CORP·Filed 1993·Granted Dec 31, 1996·112 cites·11 claims
- 1290US5497254AOptical apparatus including a liquid crystal modulatorSEIKO EPSON CORP·Filed 1994·Granted Mar 5, 1996·78 cites·12 claims
- 1388US8836947B2Sample analysis element and detecting deviceSEIKO EPSON CORP·Filed 2013·Granted Sep 16, 2014·7 cites·8 claims
- 1488US7104703B2Optical transceiver and method for producing the sameSEIKO EPSON CORP·Filed 2003·Granted Sep 12, 2006·39 cites·11 claims
- 1588US7009138B2Laser processing method, laser welding method, and laser processing apparatusSEIKO EPSON CORP·Filed 2004·Granted Mar 7, 2006·61 cites·8 claims
- 1685US8817263B2Sample analysis element and detecting deviceSEIKO EPSON CORP·Filed 2013·Granted Aug 26, 2014·5 cites·10 claims
- 1785US8710427B2Sensor chip, sensor cartridge, and analysis apparatusAMAKO JUN·Filed 2010·Granted Apr 29, 2014·5 cites·20 claims
- 1885US6596634B2Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Jul 22, 2003·37 cites·16 claims
- 1984US6376799B1Laser machining apparatus with a rotatable phase gratingSEIKO EPSON CORP·Filed 1999·Granted Apr 23, 2002·38 cites·6 claims
- 2083US9057697B2Optical device with propagating and localized surface plasmons and detection apparatusSEIKO EPSON CORP·Filed 2012·Granted Jun 16, 2015·6 cites·13 claims
- 2183US8415611B2Sensor chip, sensor cartridge, and analysis apparatusAMAKO JUN·Filed 2010·Granted Apr 9, 2013·7 cites·16 claims
- 2282US8221963B2Method for producing fine structureAMAKO JUN·Filed 2008·Granted Jul 17, 2012·6 cites·12 claims
- 2380US9151666B2Sensor chip, sensor cartridge, and analysis apparatusSEIKO EPSON CORP·Filed 2013·Granted Oct 6, 2015·2 cites·16 claims
- 2480US7867692B2Method for manufacturing a microstructure, exposure device, and electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Jan 11, 2011·7 cites·5 claims
- 2577US7255806B2Substrate processing method, method of manufacturing micro lens sheet, transmission screen, projector, display device, and substrate processing apparatusSEIKO EPSON CORP·Filed 2004·Granted Aug 14, 2007·19 cites·9 claims
- 2675US8497987B2Optical device unit and detection apparatusSAKAGAMI YUSUKE·Filed 2011·Granted Jul 30, 2013·2 cites·13 claims
- 2773US8902419B2Detection apparatusSAKAGAMI YUSUKE·Filed 2011·Granted Dec 2, 2014·2 cites·11 claims
- 2872US6946620B2Laser processing method and laser processing apparatusSEIKO EPSON CORP·Filed 2003·Granted Sep 20, 2005·12 cites·20 claims
- 2971US7885004B2Optical element, liquid crystal device, and displaySEIKO EPSON CORP·Filed 2010·Granted Feb 8, 2011·1 cites·7 claims
- 3070US9041924B2Transmissive diffraction grating and detection apparatusAMAKO JUN·Filed 2012·Granted May 26, 2015·2 cites·19 claims
- 3170US7169537B2Method of manufacturing ink jet head and ink jet headSEIKO EPSON CORP·Filed 2004·Granted Jan 30, 2007·10 cites·12 claims
- 3269US8836946B2Optical device and detection deviceAMAKO JUN·Filed 2012·Granted Sep 16, 2014·2 cites·14 claims
- 3369US8531661B2Optical device unit and detection apparatusSAKAGAMI YUSUKE·Filed 2011·Granted Sep 10, 2013·1 cites·10 claims
- 3469US7762650B2Method of manufacturing ink jet head and ink jet headSEIKO EPSON CORP·Filed 2006·Granted Jul 27, 2010·2 cites·5 claims
- 3568US7339734B2Polarization control element, manufacturing method of polarization control element, design method of polarization control element, and electronic equipmentSEIKO EPSON CORP·Filed 2005·Granted Mar 4, 2008·4 cites·3 claims
- 3668US6677237B2Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for themSEIKO EPSON CORP·Filed 2002·Granted Jan 13, 2004·12 cites·17 claims
- 3767US9222889B2Sample analysis device, testing apparatus, and sensor cartridgeSEIKO EPSON CORP·Filed 2013·Granted Dec 29, 2015·1 cites·8 claims
- 3867US8570509B2Spectrometry apparatus, detection apparatus, and method for manufacturing spectrometry apparatusAMAKO JUN·Filed 2011·Granted Oct 29, 2013·2 cites·15 claims
- 3967US6781089B2Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2002·Granted Aug 24, 2004·9 cites·27 claims
- 4066US6642480B2Laser processing method and laser processing apparatusSEIKO EPSON CORP·Filed 2002·Granted Nov 4, 2003·9 cites·7 claims
- 4165US8529782B1Microstructure manufacturing methodAMAKO JUN·Filed 2008·Granted Sep 10, 2013·1 cites·14 claims
- 4264US6507003B2Method and apparatus for laser processingSEIKO EPSON CORP·Filed 2001·Granted Jan 14, 2003·10 cites·15 claims
- 4362US7241967B2Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2004·Granted Jul 10, 2007·7 cites·13 claims
- 4462US6775958B2Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged productSEIKO EPSON CORP·Filed 2001·Granted Aug 17, 2004·9 cites·8 claims
- 4561US7387682B2Liquid drop discharge device, printer, printing method, and electro-optical deviceSEIKO EPSON CORP·Filed 2004·Granted Jun 17, 2008·5 cites·16 claims
- 4656US6424048B1Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for themSEIKO EPSON CORP·Filed 1999·Granted Jul 23, 2002·18 cites·24 claims
- 4754US2010020400A1Diffractive optical element, method for manufacturing diffractive optical element, and laser beam machining methodSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 4853US9228944B2Sample analysis element and detection deviceSEIKO EPSON CORP·Filed 2013·Granted Jan 5, 2016·0 cites·7 claims
- 4951US2007052787A1Method for fixing functional material apparatus for fixing functional material, device fabrication method, electrooptical device, and electronic equipmentSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 5049US2008274338A1Wiring substrate and method for manufacturing the sameSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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