Inventor · disambiguated record
Ismail C. Noyan
Also filed as: NOYAN ISMAIL C · NOYAN ISMAIL CEVDET
25 granted patents·2 pending applications·554 citations·filing 1989–2009
97Inventor score
Files withIBM26
Top patents by PatentIndex Score
27 records- 0196US5093879AElectro-optical connectorsIBM·Filed 1990·Granted Mar 3, 1992·218 cites·40 claims
- 0274US5186632AElectronic device elastomeric mounting and interconnection technologyIBM·Filed 1991·Granted Feb 16, 1993·36 cites·15 claims
- 0374US5093890AOptical bus for computer systemsIBM·Filed 1990·Granted Mar 3, 1992·39 cites·25 claims
- 0473US7214548B2Apparatus and method for flattening a warped substrateIBM·Filed 2004·Granted May 8, 2007·18 cites·29 claims
- 0563US5117275AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1990·Granted May 26, 1992·28 cites·12 claims
- 0661US5263620AWirebond removal apparatus using alternating fluid streamIBM·Filed 1992·Granted Nov 23, 1993·30 cites·20 claims
- 0761US5006925AThree dimensional microelectric packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·9 claims
- 0856US6029199AComputing system having a system supervisor and a collection of computing subunits each of which has a subunit supervisorIBM·Filed 1996·Granted Feb 22, 2000·35 cites·12 claims
- 0953US6503641B2Interconnects with Ti-containing linersIBM·Filed 2000·Granted Jan 7, 2003·5 cites·13 claims
- 1051US2009302474A1Atomic laminates for diffucion barrier applicationsIBM·Filed 2009·Application pending·0 cites
- 1148US5229328AMethod for bonding dielectric mounted conductors to semiconductor chip contact padsIBM·Filed 1992·Granted Jul 20, 1993·17 cites·20 claims
- 1247US5669437AHigh efficiency thermal interposerIBM·Filed 1993·Granted Sep 23, 1997·9 cites·18 claims
- 1345US5205461AMethod and apparatus for fluxless solder bondingIBM·Filed 1990·Granted Apr 27, 1993·16 cites·12 claims
- 1444US5847926ALightweight packagingIBM·Filed 1996·Granted Dec 8, 1998·11 cites·15 claims
- 1544US5446261ASolder application system using helix to control solder meniscusIBM·Filed 1993·Granted Aug 29, 1995·9 cites·13 claims
- 1642US5233221AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1991·Granted Aug 3, 1993·11 cites·17 claims
- 1739US5675884AApparatus for multilayer conductor chip packagingIBM·Filed 1995·Granted Oct 14, 1997·6 cites·6 claims
- 1839US2005070097A1Atomic laminates for diffusion barrier applicationsIBM·Filed 2003·Application pending·0 cites
- 1938US5768770AElectronic packaging shaped beam lead fabricationFiled 1995·Granted Jun 23, 1998·5 cites·10 claims
- 2037US6734363B1Lightweight electronic equipment conductor with coolant permeable supportIBM·Filed 1998·Granted May 11, 2004·6 cites·11 claims
- 2137US6211042B1Growth of epitaxial semiconductor films in presence of reactive metalIBM·Filed 1998·Granted Apr 3, 2001·6 cites·10 claims
- 2237US5074969AComposition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrateIBM·Filed 1991·Granted Dec 24, 1991·8 cites·8 claims
- 2335US5915462AHigh efficiency thermal interposerIBM·Filed 1997·Granted Jun 29, 1999·5 cites·2 claims
- 2435US5047834AHigh strength low stress encapsulation of interconnected semiconductor devicesIBM·Filed 1990·Granted Sep 10, 1991·7 cites·5 claims
- 2532US5038195AComposition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrateIBM·Filed 1990·Granted Aug 6, 1991·4 cites·49 claims
- 2630US6017401AConductivity improvement in thin films of refractory metalIBM·Filed 1998·Granted Jan 25, 2000·0 cites·17 claims
- 2730US5322204AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1993·Granted Jun 21, 1994·0 cites·5 claims
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