Inventor · disambiguated record
Satoshi Ookyuu
Also filed as: OOKYUU SATOSHI
4 granted patents·33 citations·filing 1997–1999
69Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0162US6245599B1Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrateMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 12, 2001·30 cites·17 claims
- 0231US5902119ALeadframe tip arrangement designing methodMITSUBISHI ELECTRIC CORP·Filed 1997·Granted May 11, 1999·2 cites·8 claims
- 0330US6134700ALeadframe tip arrangement designing methodMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 17, 2000·1 cites·7 claims
- 0428US6159766ADesigning method of leadframe tip arrangementMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 12, 2000·0 cites·19 claims
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