P

Inventor

TAKAHASHI YOSHIHARU

JP74 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI YOSHIHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

25 patents
US5753977AMay 19, 1998

Semiconductor device and lead frame therefor

MITSUBISHI ELECTRIC CORP198 citations99
US5207102AMay 4, 1993

Semiconductor pressure sensor

MITSUBISHI ELECTRIC CORP127 citations97
US6181009B1Jan 30, 2001

Electronic component with a lead frame and insulating coating

MITSUBISHI ELECTRIC CORP28 citations96
US5333505AAug 2, 1994

Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same

MITSUBISHI ELECTRIC CORP64 citations96
US5021865AJun 4, 1991

Lead frame for semiconductor device

MITSUBISHI ELECTRIC CORP51 citations95
US5766972AJun 16, 1998

Method of making resin encapsulated semiconductor device with bump electrodes

MITSUBISHI ELECTRIC CORP224 citations94
US6650012B1Nov 18, 2003

Semiconductor device

MITSUBISHI ELECTRIC CORP29 citations93
US6563209B1May 13, 2003

Lead frame for semiconductor device

MITSUBISHI ELECTRIC CORP21 citations93
US6454158B1Sep 24, 2002

Wire bonding apparatus and wire bonding method of semiconductor device

MITSUBISHI ELECTRIC CORP20 citations93
US6020625AFeb 1, 2000

Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame

MITSUBISHI ELECTRIC CORP143 citations93
US5793100AAug 11, 1998

Lead frame for semiconductor device

MITSUBISHI ELECTRIC CORP21 citations93
US5225373AJul 6, 1993

Method of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chips

MITSUBISHI ELECTRIC CORP35 citations91
US5126813AJun 30, 1992

Semiconductor pressure sensor device with two semiconductor pressure sensor chips and a method of manufacturing thereof

MITSUBISHI ELECTRIC CORP25 citations91
US6245599B1Jun 12, 2001

Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate

MITSUBISHI ELECTRIC CORP30 citations90
US6087201AJul 11, 2000

Method of manufacturing ball grid array electronic component

MITSUBISHI ELECTRIC CORP13 citations82
US5900671AMay 4, 1999

Electronic component including conductor connected to electrode and anodically bonded to insulating coating

MITSUBISHI ELECTRIC CORP12 citations82
US6790711B2Sep 14, 2004

Method of making semiconductor device

MITSUBISHI ELECTRIC CORP7 citations74
US6516994B2Feb 11, 2003

Wire bonding apparatus for connecting semiconductor devices

MITSUBISHI ELECTRIC CORP10 citations74
US6310395B1Oct 30, 2001

Electronic component with anodically bonded contact

MITSUBISHI ELECTRIC CORP6 citations74
US6268647B1Jul 31, 2001

Electronic component with an insulating coating

MITSUBISHI ELECTRIC CORP7 citations74
US6133069AOct 17, 2000

Method of manufacturing the electronic using the anode junction method

MITSUBISHI ELECTRIC CORP3 citations74
US5872394AFeb 16, 1999

Lead frame

MITSUBISHI ELECTRIC CORP7 citations74
US5786639AJul 28, 1998

Wiring member and lead frame having the same

MITSUBISHI ELECTRIC CORP15 citations74
US5530270AJun 25, 1996

Substrate for semiconductr device

MITSUBISHI ELECTRIC CORP13 citations71
USRE38043EMar 25, 2003

Lead frame

MITSUBISHI ELECTRIC CORP2 citations63

KONISHIROKU PHOTO IND

9 patents

TAKAHASHI YOSHIHARU

4 patents

DORYOKURO KAKUNENRYO

3 patents

HITACHI LTD

1 patent

SAMEI MASAHIRO

1 patent

NAITOH YUTAKA

1 patent

IKEDA TAMOTSU

1 patent

FUJIWARA HITOSHI

1 patent

XING INC

1 patent

MAZDA MOTOR

1 patent

RICOH CO LTD

1 patent

KONICA MINOLTA OPTO INC

1 patent

Showing the top 50 of 74 patents by PatentIndex Score.