Inventor · disambiguated record
Yi-How Chou
Also filed as: CHOU YI · CHOU YI-HOW
4 granted patents·1 pending application·3 citations·filing 2017–2024
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0187US11450558B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·2 cites·9 claims
- 0280US2025079237A1Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0374US12183626B2Metal interconnect structure having cap layer with different thicknesses and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·9 claims
- 0463US10879194B2Semiconductor device package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·1 cites·20 claims
- 0556US10784153B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →