Inventor · disambiguated record
Albert W. Chan
Also filed as: CHAN ALBERT W · CHAN ALBERT WONG
7 granted patents·1 pending application·194 citations·filing 1998–2001
87Inventor score
Files withFUJITSU LTD7
Top patents by PatentIndex Score
8 records- 0195US6054761AMulti-layer circuit substrates and electrical assemblies having conductive composition connectorsFUJITSU LTD·Filed 1998·Granted Apr 25, 2000·103 cites·38 claims
- 0286US6518096B2Interconnect assembly and Z-connection method for fine pitch substratesFUJITSU LTD·Filed 2001·Granted Feb 11, 2003·39 cites·26 claims
- 0367US6592943B2Stencil and method for depositing solderFUJITSU LTD·Filed 2001·Granted Jul 15, 2003·19 cites·10 claims
- 0461US6579474B2Conductive compositionFUJITSU LTD·Filed 2001·Granted Jun 17, 2003·6 cites·20 claims
- 0554US6866741B2Method for joining large substratesFUJITSU LTD·Filed 2001·Granted Mar 15, 2005·5 cites·21 claims
- 0654US6047637AMethod of paste printing using stencil and masking layerFUJITSU LTD·Filed 1999·Granted Apr 11, 2000·16 cites·8 claims
- 0740US6281040B1Methods for making circuit substrates and electrical assembliesFUJITSU LTD·Filed 1999·Granted Aug 28, 2001·6 cites·89 claims
- 0839US2002119396A1Structure and method for forming z-laminated multilayered packaging substrateFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →