Inventor · disambiguated record
Hwang-Bok Ryu
Also filed as: RYU HWANG-BOK
2 granted patents·1 pending application·4 citations·filing 2009–2012
47Inventor score
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3 records- 0162US8053351B2Method of forming at least one bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 8, 2011·2 cites·16 claims
- 0249US8156636B2Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatusKIM GOON WOO·Filed 2009·Granted Apr 17, 2012·2 cites·13 claims
- 0341US2013223001A1Printed circuit board and memory module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
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