Inventor · disambiguated record
Arun K. Chaudhuri
Also filed as: CHAUDHURI ARUN K
12 granted patents·4 pending applications·291 citations·filing 1987–2008
92Inventor score
Top patents by PatentIndex Score
16 records- 0193US6660560B2No-flow underfill material and underfill method for flip chip devicesDELPHI TECH INC·Filed 2001·Granted Dec 9, 2003·77 cites·11 claims
- 0290US6822018B2Thermally-conductive electrically-insulating polymer-base materialDELPHI TECH INC·Filed 2002·Granted Nov 23, 2004·27 cites·20 claims
- 0389US6802446B2Conductive adhesive material with metallurgically-bonded conductive particlesDELPHI TECH INC·Filed 2002·Granted Oct 12, 2004·48 cites·26 claims
- 0483US4741925AMethod of forming silicon nitride coatingGTE PROD CORP·Filed 1987·Granted May 3, 1988·46 cites·8 claims
- 0580US6703128B2Thermally-capacitive phase change encapsulant for electronic devicesDELPHI TECH INC·Filed 2002·Granted Mar 9, 2004·31 cites·20 claims
- 0676US6943058B2No-flow underfill process and material thereforDELPHI TECH INC·Filed 2003·Granted Sep 13, 2005·24 cites·20 claims
- 0775US6916684B2Wafer-applied underfill processDELPHI TECH INC·Filed 2003·Granted Jul 12, 2005·24 cites·20 claims
- 0861US7754824B2Dendritic polyol, cycloaliphatic epoxy resin and cationic initiatorDELPHI TECH INC·Filed 2008·Granted Jul 13, 2010·0 cites·1 claims
- 0953US7498376B2Thermal transient suppression material and method of productionDELPHI TECH INC·Filed 2004·Granted Mar 3, 2009·5 cites·12 claims
- 1053US7119449B2Enhancement of underfill physical properties by the addition of thermotropic celluloseDELPHI TECH INC·Filed 2003·Granted Oct 10, 2006·6 cites·15 claims
- 1152US2005137286A1Thermally-conductive electrically-insulating polymer-base materialDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 1244US2006252892A1Hyperbranched polymer and cycloaliphatic epoxy resin thermosetsBASHEER RAFIL A·Filed 2005·Application pending·0 cites
- 1343US7324715B2Optical information processing circuit assemblyDELPHI TECH INC·Filed 2002·Granted Jan 29, 2008·2 cites·23 claims
- 1435US2005014313A1Underfill methodFiled 2003·Application pending·0 cites
- 1532US2006199301A1Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there fromBASHEER RAFIL A·Filed 2005·Application pending·0 cites
- 1629US4937414AWire guide for electrical discharge machining apparatusPERREAULT DAVID J·Filed 1988·Granted Jun 26, 1990·1 cites·2 claims
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