Inventor · disambiguated record
Deok Chun Jang
Also filed as: JANG DEOK CHUN
7 granted patents·3 pending applications·8 citations·filing 2009–2021
74Inventor score
Top patents by PatentIndex Score
10 records- 0173US11183413B2Methods related to preparation of a stencil to receive a plurality of IC unitsROKKO SYSTEMS PTE LTD·Filed 2016·Granted Nov 23, 2021·2 cites·6 claims
- 0269US8997592B2Assembly and method for IC unit engagementYANG HAE CHOON·Filed 2010·Granted Apr 7, 2015·4 cites·19 claims
- 0361US10907247B2Apparatus and method for processing sputtered IC unitsROKKO SYSTEMS PTE LTD·Filed 2015·Granted Feb 2, 2021·1 cites·5 claims
- 0451US8890018B2Method and apparatus for improved sorting of diced substratesJUNG JONG JAE·Filed 2010·Granted Nov 18, 2014·1 cites·10 claims
- 0550US11791183B2Method and apparatus for IC unit singulation and sortingROKKO SYSTEMS PTE LTD·Filed 2021·Granted Oct 17, 2023·0 cites·3 claims
- 0648US11476150B2Sputtering processing and apparatusROKKO SYSTEMS PTE LTD·Filed 2020·Granted Oct 18, 2022·0 cites·11 claims
- 0743US11706875B2Unit unloading systemROKKO SYSTEMS PTE LTD·Filed 2018·Granted Jul 18, 2023·0 cites·5 claims
- 0838US2011036339A1Apparatus and method for multiple substrate processingJUNG JONG JAE·Filed 2009·Application pending·0 cites
- 0929US2013209205A1System and method for offloading ic unitsYANG HAE CHOON·Filed 2011·Application pending·0 cites
- 1027US2012184086A1Punch singulation system and methodYANG HAE CHOON·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →