Inventor · disambiguated record

Joseph Piccirillo, Jr.

Also filed as: PICCIRILLO JR JOSEPH

2 granted patents·13 citations·filing 2012–2012

55Inventor score

Technology areasH10W

Files withHEBDING JEREMIAH1 PASCUAL DANIEL1

Top patents by PatentIndex Score

2 records

0181US8697542B2Method for thin die-to-wafer bondingPASCUAL DANIEL·Filed 2012·Granted Apr 15, 2014·11 cites·18 claims
0254US8969200B2Apparatus and method for integration of through substrate viasHEBDING JEREMIAH·Filed 2012·Granted Mar 3, 2015·2 cites·17 claims

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