Inventor · disambiguated record
Akira Tojo
Also filed as: TOJO AKIRA
12 granted patents·8 pending applications·11 citations·filing 2008–2025
82Inventor score
Top patents by PatentIndex Score
20 records- 0185US8975732B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Mar 10, 2015·8 cites·12 claims
- 0257US12230841B2BatteryTOSHIBA KK·Filed 2021·Granted Feb 18, 2025·0 cites·5 claims
- 0357US8008773B2Semiconductor device and method for fabricating semiconductor deviceTOSHIBA KK·Filed 2009·Granted Aug 30, 2011·1 cites·8 claims
- 0454US8193643B2Semiconductor device and method for fabricating the sameTOJO AKIRA·Filed 2009·Granted Jun 5, 2012·2 cites·8 claims
- 0551US2025300122A1Wire bonding apparatus and control methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0651US2025300123A1Wire bonding apparatus, operation method, and control methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0749US11610860B2Wire bonding apparatus and wire bonding methodTOSHIBA KK·Filed 2020·Granted Mar 21, 2023·0 cites·7 claims
- 0849US10811391B2Semiconductor device and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2019·Granted Oct 20, 2020·0 cites·9 claims
- 0948US2025259963A1Wire bonding apparatus, control device, and control methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1046US10573603B2Semiconductor device having a three-sided textured substrateTOSHIBA KK·Filed 2018·Granted Feb 25, 2020·0 cites·10 claims
- 1144US10510726B2Semiconductor device, method for manufacturing semiconductor device, and method for manufacturing semiconductor packageTOSHIBA KK·Filed 2018·Granted Dec 17, 2019·0 cites·16 claims
- 1243US8378479B2Semiconductor device and method for fabricating semiconductor deviceTOSHIBA KK·Filed 2011·Granted Feb 19, 2013·0 cites·1 claims
- 1343US2008179751A1Manufacturing method of semiconductor devices and semiconductor device manufactured therebyTOSHIBA KK·Filed 2008·Application pending·0 cites
- 1443US2008217754A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2008·Application pending·0 cites
- 1541US10438935B1Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Oct 8, 2019·0 cites·15 claims
- 1636US2013078766A1Method for manufacturing semiconductor apparatusNOGI TAKAO·Filed 2012·Application pending·0 cites
- 1736US2009209065A1Method of manufacturing semiconductor device and ultrasonic bonding apparatusNISHIUCHI HIDEO·Filed 2009·Application pending·0 cites
- 1835US2011186982A1Surface mount diode and method of fabricating the sameTOSHIBA KK·Filed 2011·Application pending·0 cites
- 1932US8859415B2Method of forming wiring of a semiconductor deviceTAJIMA TAKAYUKI·Filed 2012·Granted Oct 14, 2014·0 cites·10 claims
- 2032US8334173B2Method for manufacturing semiconductor apparatusNOGI TAKAO·Filed 2010·Granted Dec 18, 2012·0 cites·10 claims
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