Inventor · disambiguated record
Ting-Feng Su
Also filed as: Su ting-feng
5 granted patents·3 pending applications·15 citations·filing 2008–2019
72Inventor score
Top patents by PatentIndex Score
8 records- 0182US9899287B2Fan-out wafer level package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Feb 20, 2018·5 cites·18 claims
- 0273US7913539B2Apparatus for drop testing and method utilizing the samePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Mar 29, 2011·5 cites·14 claims
- 0364US8063492B2Multi-chip stacked packageSu ting-feng·Filed 2009·Granted Nov 22, 2011·5 cites·11 claims
- 0440US10177077B2Chip structure having redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 0539US2021035939A1Package structurePOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 0637US2020312734A1Semiconductor package with an internal heat sink and method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 0734US10249573B2Semiconductor device package with a stress relax patternPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 2, 2019·0 cites·18 claims
- 0832US2013075881A1Memory card package with a small substrateHUANG WAN-YU·Filed 2011·Application pending·0 cites
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