Inventor · disambiguated record

Marco Sobkowiak

Also filed as: SOBKOWIAK MARCO

2 granted patents·16 citations·filing 2017–2018

54Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG2

Top patents by PatentIndex Score

2 records

0193US10074590B1Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·16 cites·30 claims
0253US10283432B2Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 7, 2019·0 cites·20 claims

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