Inventor · disambiguated record
Jack E. Murray
Also filed as: MURRAY JACK E
10 granted patents·1 pending application·51 citations·filing 2000–2024
87Inventor score
Top patents by PatentIndex Score
11 records- 0196US9418926B1Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 16, 2016·19 cites·5 claims
- 0290US10032703B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·5 cites·12 claims
- 0387US10381297B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·3 cites·12 claims
- 0486US2024339390A1Package-on-package semiconductor assemblies and methods of manufacturing the sameLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 0585US11139229B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 5, 2021·2 cites·20 claims
- 0680US10825761B2Electronic devices having tapered edge wallsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 3, 2020·2 cites·20 claims
- 0779US11791252B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 17, 2023·0 cites·27 claims
- 0876US12033929B2Package-on-package semiconductor assemblies and methods of manufacturing the sameLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Jul 9, 2024·0 cites·16 claims
- 0972US6227076B1Shaft wrenchFiled 2000·Granted May 8, 2001·20 cites·18 claims
- 1059US10825762B2Methods of processing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 3, 2020·0 cites·21 claims
- 1156US10276479B1Methods of processing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·0 cites·19 claims
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