Inventor · disambiguated record
Trismardawi Tanadi
Also filed as: TANADI TRISMARDAWI
9 granted patents·1 pending application·15 citations·filing 2013–2024
83Inventor score
Files withMICRON TECHNOLOGY INC10
Top patents by PatentIndex Score
10 records- 0184US9305905B2Apparatuses and related methods for staggering power-up of a stack of semiconductor diesMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 5, 2016·6 cites·26 claims
- 0282US10120404B2Apparatuses and related methods for staggering power-up of a stack of semiconductor diesMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 6, 2018·3 cites·11 claims
- 0380US11107795B2Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufactureMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 31, 2021·2 cites·16 claims
- 0476US9875993B2Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufactureMICRON TECHNOLOGY INC·Filed 2016·Granted Jan 23, 2018·2 cites·16 claims
- 0572US11594522B2Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufactureMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 28, 2023·0 cites·18 claims
- 0672US11092990B2Apparatuses and related methods for staggering power-up of a stack of semiconductor diesMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 17, 2021·1 cites·11 claims
- 0772US10388630B2Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufactureMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 20, 2019·1 cites·13 claims
- 0866US2024338139A1Wordline leakage test managementMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0961US12045482B2Wordline leakage test managementMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 23, 2024·0 cites·14 claims
- 1052US9785171B2Apparatuses and related methods for staggering power-up of a stack of semiconductor diesMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 10, 2017·0 cites·14 claims
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