Inventor · disambiguated record
Yi-Li Hsiao
Also filed as: HSIAO YI-LI
51 granted patents·13 pending applications·217 citations·filing 1999–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24TAIWAN SEMICONDUCTOR MFG23HSIAO YI-LI10HWANG CHIEN LING4JANG BOR-PING1
Top patents by PatentIndex Score
64 records- 0193US7829815B2Adjustable electrodes and coils for plasma density distribution controlTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 9, 2010·25 cites·38 claims
- 0292US9455183B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 27, 2016·10 cites·22 claims
- 0390US11955378B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 0489US7891536B2PVD target with end of service life detection capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 22, 2011·9 cites·12 claims
- 0588US11443981B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
- 0688US8827695B2Wafer's ambiance controlHSIAO YI-LI·Filed 2009·Granted Sep 9, 2014·14 cites·20 claims
- 0788US8109407B2Apparatus for storing substratesHSIAO YI-LI·Filed 2007·Granted Feb 7, 2012·14 cites·21 claims
- 0885US9960134B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·3 cites·20 claims
- 0984US9966357B2Pick-and-place tool for packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 1083US8546802B2Pick-and-place tool for packaging processHWANG CHIEN LING·Filed 2011·Granted Oct 1, 2013·6 cites·20 claims
- 1183US8373269B1Jigs with controlled spacing for bonding dies onto package substratesTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 12, 2013·6 cites·20 claims
- 1282US8540136B1Methods for stud bump formation and apparatus for performing the sameLIN YEONG-JYH·Filed 2012·Granted Sep 24, 2013·6 cites·19 claims
- 1382US2025309189A1Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1481US7758338B2Substrate carrier, port apparatus and facility interface and apparatus including sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 20, 2010·7 cites·23 claims
- 1578US8276648B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2012·Granted Oct 2, 2012·1 cites·6 claims
- 1678US2024312872A1Apparatus including cooling structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1777US12027446B2Method for forming a semiconductor component with a cooling structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1877US8322299B2Cluster processing apparatus for metallization processing in semiconductor manufacturingYU CHEN-HUA·Filed 2006·Granted Dec 4, 2012·5 cites·22 claims
- 1977US7418982B2Substrate carrier and facility interface and apparatus including sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 2, 2008·4 cites·15 claims
- 2076US10147693B2Methods for stud bump formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 4, 2018·2 cites·20 claims
- 2175US12463175B2Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 2274US9498851B2Methods for forming apparatus for stud bump formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·20 claims
- 2373US9521795B2Two-step direct bonding processes and tools for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 13, 2016·3 cites·20 claims
- 2472US9324670B2Semiconductor device with copper-tin compound on copper connectorTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·2 cites·20 claims
- 2572US7642100B2Method and system for yield and productivity improvements in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jan 5, 2010·4 cites·29 claims
- 2671US9105760B2Pick-and-place tool for packaging processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 11, 2015·2 cites·20 claims
- 2770US9021682B2Apparatus for stud bump formationHWANG CHIEN LING·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 2869US9700950B2Innovative multi-purpose dipping plateJANG BOR-PING·Filed 2012·Granted Jul 11, 2017·2 cites·19 claims
- 2969US9343436B2Stacked package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·2 cites·20 claims
- 3069US7918251B2Substrate carrier and facility interface and apparatus including sameTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 5, 2011·2 cites·19 claims
- 3168US11515233B2Semiconductor component with cooling structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·6 claims
- 3268US9978709B2Solder bump stretching method for forming a solder bump joint in a deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·1 cites·20 claims
- 3368US9893046B2Thinning process using metal-assisted chemical etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·1 cites·20 claims
- 3467US6546307B1Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer systemTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 8, 2003·33 cites·16 claims
- 3565US11348889B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 3665US6543988B2Apparatus for clamping and transporting a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 8, 2003·12 cites·11 claims
- 3765US6040585AMethod for detecting wafer orientation during transportTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 21, 2000·29 cites·20 claims
- 3863US9475145B2Solder bump joint in a device including lamellar structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 25, 2016·1 cites·20 claims
- 3961US11342302B2Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 24, 2022·0 cites·20 claims
- 4061US2011126397A1Pvd target with end of service life detection capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
- 4160US10522491B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 4258US9842817B2Solder bump stretching method and device for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·6 claims
- 4357US10163835B2Solder bump stretching methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 4456US8936730B2Methods for forming apparatus for stud bump formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 20, 2015·0 cites·18 claims
- 4555US8101052B2Adjustable anode assembly for a substrate wet processing apparatusHSIAO YI-LI·Filed 2006·Granted Jan 24, 2012·0 cites·18 claims
- 4653US9263407B2Method for manufacturing a plurality of metal postsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·0 cites·7 claims
- 4751US10034390B2Metal post bonding using pre-fabricated metal postsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 4851US8795486B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2006·Granted Aug 5, 2014·0 cites·20 claims
- 4951US2007068796A1Method of using a target having end of service life detection capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 5051US2012061059A1Cooling mechanism for stacked die package and method of manufacturing the sameHSIAO YI-LI·Filed 2011·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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