Inventor · disambiguated record
Shoa-Siong Raymond Lim
Also filed as: LIM SHOA SIONG · LIM SHOA SIONG RAYMOND
21 granted patents·5 pending applications·31 citations·filing 2007–2018
92Inventor score
Files withADVANPACK SOLUTIONS PTE LTD17LIM SHOA SIONG3CHEW HWEE-SENG JIMMY2AGENCY SCIENCE TECH & RES1CHEW HWEE SENG1
Top patents by PatentIndex Score
26 records- 0195US9653323B2Manufacturing method of substrate structure having embedded interconnection layersADVANPACK SOLUTIONS PTE LTD·Filed 2016·Granted May 16, 2017·12 cites·14 claims
- 0280US9892916B2Manufacturing method of package substrate and package manufacturing method of semiconductor deviceADVANPACK SOLUTIONS PTE LTD·Filed 2016·Granted Feb 13, 2018·3 cites·14 claims
- 0377US8709874B2Manufacturing method for semiconductor device carrier and semiconductor package using the sameCHEW HWEE-SENG JIMMY·Filed 2011·Granted Apr 29, 2014·4 cites·28 claims
- 0475US9219027B2Semiconductor device carrier and semiconductor package using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Dec 22, 2015·3 cites·21 claims
- 0572US9301391B2Substrate structure, semiconductor package device, and manufacturing method of substrate structureADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Mar 29, 2016·2 cites·15 claims
- 0669US9379044B2Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Jun 28, 2016·2 cites·19 claims
- 0767US8917521B2Etch-back type semiconductor package, substrate and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2011·Granted Dec 23, 2014·2 cites·23 claims
- 0863US10049950B2Multi-layer substrate for semiconductor packagingADVANPACK SOLUTIONS PTE LTD·Filed 2013·Granted Aug 14, 2018·1 cites·23 claims
- 0955US10446457B2Multi-layer substrate for semiconductor packagingADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Oct 15, 2019·0 cites·6 claims
- 1054US9754899B2Semiconductor structure and method of fabricating the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Sep 5, 2017·0 cites·23 claims
- 1153US9305868B2Manufacturing method of forming an etch-back type semiconductor package with locking anchoragesADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Apr 5, 2016·0 cites·22 claims
- 1253US9136215B2Manufacturing method for semiconductor packageLIM SHOA SIONG·Filed 2009·Granted Sep 15, 2015·2 cites·13 claims
- 1352US10763133B2Semiconductor structure and semiconductor package device using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 1451US9723717B2Substrate structure, semiconductor package device, and manufacturing method of semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Aug 1, 2017·0 cites·8 claims
- 1551US9583449B2Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Granted Feb 28, 2017·0 cites·13 claims
- 1650US10154588B2Manufacturing method of semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2017·Granted Dec 11, 2018·0 cites·16 claims
- 1749US9847268B2Semiconductor package and manufacturing method thereofLIM SHOA SIONG·Filed 2009·Granted Dec 19, 2017·0 cites·29 claims
- 1848US2018108584A1Semiconductor SubstrateADVANPACK SOLUTIONS PTE LTD·Filed 2017·Application pending·0 cites
- 1948US2017330842A1Semiconductor Assembly and Method of Fabricating a Semiconductor StructureADVANPACK SOLUTIONS PTE LTD·Filed 2017·Application pending·0 cites
- 2047US9120169B2Method for device packagingCHEW HWEE SENG·Filed 2009·Granted Sep 1, 2015·0 cites·17 claims
- 2146US9059050B2Manufacturing methods of semiconductor substrate, package and deviceADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Jun 16, 2015·0 cites·30 claims
- 2246US8664750B2Semiconductor substrate, package and deviceLIM SHOA SIONG·Filed 2009·Granted Mar 4, 2014·0 cites·37 claims
- 2343US2015287673A1Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Application pending·0 cites
- 2442US10109503B2Method of manufacturing semiconductor package deviceCHEW JIMMY HWEE SENG·Filed 2012·Granted Oct 23, 2018·0 cites·27 claims
- 2542US2009091025A1Method for forming and releasing interconnectsAGENCY SCIENCE TECH & RES·Filed 2007·Application pending·0 cites
- 2641US2015348895A1Substrate for semiconductor packaging and method of forming samePBT PTE LTD·Filed 2014·Application pending·0 cites
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