Inventor · disambiguated record
Shinya Uchibori
Also filed as: UCHIBORI SHINYA
13 granted patents·2 pending applications·456 citations·filing 1988–2019
92Inventor score
Top patents by PatentIndex Score
15 records- 0196US5645932ACircuit-like metallic foil sheet and the like and process for producing themMIYAKE KK·Filed 1994·Granted Jul 8, 1997·171 cites·15 claims
- 0290US6458465B1Circuit-like metallic foil sheet and the like and process for producing themMIYAKE KK·Filed 2000·Granted Oct 1, 2002·40 cites·4 claims
- 0386US6618939B2Process for producing resonant tagMIYAKE KK·Filed 1999·Granted Sep 16, 2003·54 cites·3 claims
- 0485US4970495AResonant frequency characteristic tag and method of manufacturing the sameTOKAI METALS CO·Filed 1988·Granted Nov 13, 1990·46 cites·3 claims
- 0584US6214444B1Circuit-like metallic foil sheet and the like and processing for producing themMIYAKE KK·Filed 1997·Granted Apr 10, 2001·62 cites·2 claims
- 0675US7256738B2Resonant circuitsMIYAKE KK·Filed 2003·Granted Aug 14, 2007·26 cites·5 claims
- 0774US6383616B1Circuit-like metallic foil sheet and the like and process for producing themMIYAKE KK·Filed 1997·Granted May 7, 2002·45 cites·4 claims
- 0856US9686854B2Electronic deviceDENSO CORP·Filed 2013·Granted Jun 20, 2017·1 cites·20 claims
- 0951US10651118B2Electronic deviceDENSO CORP·Filed 2019·Granted May 12, 2020·0 cites·3 claims
- 1049US4985288AResonant frequency characteristic tag and method of manufacturing the sameTOKAI METALS CO·Filed 1989·Granted Jan 15, 1991·11 cites·29 claims
- 1144US2016163613A1Electronic apparatusDENSO CORP·Filed 2014·Application pending·0 cites
- 1240US9646907B2Mold package and manufacturing method thereofDENSO CORP·Filed 2014·Granted May 9, 2017·0 cites·4 claims
- 1339US9941182B2Electronic device and method for manufacturing sameDENSO CORP·Filed 2014·Granted Apr 10, 2018·0 cites·4 claims
- 1439US2016105958A1Multi-layer substrate, electronic device using multi-layer substrate, manufacturing method for multilayer substrate, substrate, and electronic device using substrateDENSO CORP·Filed 2014·Application pending·0 cites
- 1535US8426747B2Printed wiring boardUCHIBORI SHINYA·Filed 2010·Granted Apr 23, 2013·0 cites·15 claims
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