Inventor · disambiguated record
Marvin W. Cowens
Also filed as: COWENS MARVIN W · COWENS MARVIN WAYNE
9 granted patents·6 pending applications·340 citations·filing 1995–2012
88Inventor score
Files withTEXAS INSTRUMENTS INC10COWENS MARVIN W1DUNNE RAJIV CARL1ODEGARD CHARLES A1ODEGARD CHARLES ANTHONY1
Top patents by PatentIndex Score
15 records- 0194US6624944B1Fluorinated coating for an optical elementTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 23, 2003·141 cites·24 claims
- 0286US6869831B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 22, 2005·35 cites·12 claims
- 0385US5580251AElectronic refreshable tactile display for Braille text and graphicsTEXAS INSTRUMENTS INC·Filed 1995·Granted Dec 3, 1996·156 cites·11 claims
- 0476US7319275B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 15, 2008·5 cites·10 claims
- 0561US7445960B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 4, 2008·1 cites·10 claims
- 0660US7276401B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 2, 2007·1 cites·10 claims
- 0760US7271494B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 18, 2007·1 cites·6 claims
- 0847US2008085573A1Underfill dispense at substrate apertureTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 0946US2010159644A1Low-cost flip-chip interconnect with an integrated wafer-applied photo-sensitive adhesive and metal-loaded epoxy paste systemDUNNE RAJIV CARL·Filed 2009·Application pending·0 cites
- 1043US2009039524A1Methods and apparatus to support an overhanging region of a stacked dieTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1141US2006234427A1Underfill dispense at substrate apertureODEGARD CHARLES A·Filed 2005·Application pending·0 cites
- 1240US2007111500A1Method and apparatus for attaching solder balls to substrateCOWENS MARVIN W·Filed 2006·Application pending·0 cites
- 1337US8674504B2Wire-based methodology of widening the pitch of semiconductor chip terminalsODEGARD CHARLES ANTHONY·Filed 2012·Granted Mar 18, 2014·0 cites·21 claims
- 1436US2005151273A1Semiconductor chip packageFiled 2003·Application pending·0 cites
- 1519US6087192APolymer markerTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 11, 2000·0 cites·14 claims
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