Inventor · disambiguated record
Chu-Chin Hu
Also filed as: HU CHU-CHIN
22 granted patents·15 pending applications·178 citations·filing 2001–2023
93Inventor score
Files withPHOENIX PIONEER TECHNOLOGY CO LTD17PHOENIX PREC TECHNOLOGY CORP8PHOENIX & CORP5HU CHU-CHIN3ZHEN DING TECHNOLOGY CO LTD2
Top patents by PatentIndex Score
37 records- 0192US7417299B2Direct connection multi-chip semiconductor element structurePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Aug 26, 2008·82 cites·8 claims
- 0289US7112524B2Substrate for pre-soldering material and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Sep 26, 2006·39 cites·3 claims
- 0385US9754982B2Packaging module and substrate structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 0478US7319276B2Substrate for pre-soldering material and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jan 15, 2008·6 cites·2 claims
- 0577US10002823B2Packaging substrate and method of fabricating the samePHOENIX & CORP·Filed 2017·Granted Jun 19, 2018·2 cites·5 claims
- 0675US10079220B2Package substrate having a plurality of chips electrically connected by conductive vias and wiring bondingPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Sep 18, 2018·2 cites·6 claims
- 0775US8531021B2Package stack device and fabrication method thereofHU CHU-CHIN·Filed 2011·Granted Sep 10, 2013·4 cites·8 claims
- 0874US7190592B2Integrated library core for embedded passive components and method for forming electronic device thereonPHOENIX PREC TECHNOLOGY CORP·Filed 2003·Granted Mar 13, 2007·21 cites·10 claims
- 0968US8354338B2Carrier board structure with embedded semiconductor chip and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jan 15, 2013·4 cites·7 claims
- 1066US10580739B2Package substrate and associated fabrication method with varying depths for circuit device terminalsPHOENIX & CORP·Filed 2017·Granted Mar 3, 2020·1 cites·14 claims
- 1164US9831217B2Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 28, 2017·1 cites·10 claims
- 1264US9613894B2Electronic packagePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Apr 4, 2017·1 cites·16 claims
- 1363US10204865B2Electronic package and conductive structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Feb 12, 2019·1 cites·18 claims
- 1460US9589935B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·20 claims
- 1560US6576541B2Method and structure for producing bumps on an IC package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Jun 10, 2003·8 cites·13 claims
- 1659US2024161957A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1755US11031329B2Method of fabricating packaging substratePHOENIX & CORP·Filed 2018·Granted Jun 8, 2021·0 cites·13 claims
- 1853US11658104B2Intermediate substrate and fabrication method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted May 23, 2023·0 cites·21 claims
- 1950US2021320096A1Manufacturing method for semiconductor package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 2048US2017317031A1Fabrication Method OF A Package SubstratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 2147US2017194262A1Package substrate and its fabrication methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 2246US9601402B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Mar 21, 2017·0 cites·34 claims
- 2346US2020135693A1Semiconductor package structure and method of making the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 2444US2007020812A1Circuit board structure integrated with semiconductor chip and method of fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 2544US2015382469A1Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 2644US2006279000A1Pre-solder structure on semiconductor package substrate and method for fabricating the sameCHANG RUEI-CHIH·Filed 2006·Application pending·0 cites
- 2743US2020075554A1Electronic package and method for fabricating the samePHOENIX & CORP·Filed 2019·Application pending·0 cites
- 2842US9357647B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted May 31, 2016·0 cites·7 claims
- 2941US11488911B2Flip-chip package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2018·Granted Nov 1, 2022·0 cites·7 claims
- 3041US2014036465A1Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 3138US10784205B2Electronic packagePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Sep 22, 2020·0 cites·16 claims
- 3238US2005167830A1Pre-solder structure on semiconductor package substrate and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Application pending·0 cites
- 3338US2006284288A1Wafer and single chip having circuit rearranged structure and method for fabricating the sameHU CHU-CHIN·Filed 2006·Application pending·0 cites
- 3438US2019206754A1Electronic package and method of manufacturing the samePHOENIX & CORP·Filed 2018·Application pending·0 cites
- 3535US8222080B2Fabrication method of package structureHU CHU-CHIN·Filed 2010·Granted Jul 17, 2012·0 cites·11 claims
- 3633US2016192525A1Stacked package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 3729US2005239269A1Method for releasing stress of embedded chip and chip embedded structurePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →