Inventor · disambiguated record
Shinji Baba
Also filed as: BABA SHINJI
60 granted patents·16 pending applications·1,320 citations·filing 1994–2019
99Inventor score
Files withRENESAS ELECTRONICS CORP29MITSUBISHI ELECTRIC CORP25RENESAS TECH CORP10BABA SHINJI4ENOMOTO HIROFUMI1
Top patents by PatentIndex Score
76 records- 0197US7791204B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Sep 7, 2010·29 cites·17 claims
- 0297US5969426ASubstrateless resin encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 19, 1999·262 cites·11 claims
- 0395US10325841B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 18, 2019·19 cites·15 claims
- 0495US5656863AResin seal semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 12, 1997·183 cites·24 claims
- 0594US7521799B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Apr 21, 2009·17 cites·6 claims
- 0694US6459152B1Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surfaceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 1, 2002·67 cites·3 claims
- 0792US8729709B2Semiconductor deviceBABA SHINJI·Filed 2011·Granted May 20, 2014·12 cites·14 claims
- 0892US8314495B2Semiconductor device and method of manufacturing the sameHAYASHI EIJI·Filed 2012·Granted Nov 20, 2012·10 cites·12 claims
- 0992US7233065B2Semiconductor device having capacitors for reducing power source noiseRENESAS TECH CORP·Filed 2005·Granted Jun 19, 2007·33 cites·2 claims
- 1091US6071755AMethod of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 6, 2000·101 cites·8 claims
- 1190US9831166B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 28, 2017·3 cites·14 claims
- 1290US8018066B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 13, 2011·6 cites·17 claims
- 1389US10714415B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Jul 14, 2020·2 cites·28 claims
- 1489US9576890B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 21, 2017·3 cites·7 claims
- 1589US8928147B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 6, 2015·4 cites·7 claims
- 1689US8822269B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·4 cites·8 claims
- 1789US6873035B2Semiconductor device having capacitors for reducing power source noiseRENESAS TECH CORP·Filed 2001·Granted Mar 29, 2005·53 cites·11 claims
- 1887US6369443B1Semiconductor device with stacked viasMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 9, 2002·44 cites·15 claims
- 1986US10570795B2Combustion engine exhaust gas purifying facilityHITACHI SHIPBUILDING ENG CO·Filed 2016·Granted Feb 25, 2020·3 cites·6 claims
- 2086US6191493B1Resin seal semiconductor package and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Feb 20, 2001·67 cites·6 claims
- 2185US9559573B2Method of manufacturing stator of electric rotating machineBABA SHINJI·Filed 2013·Granted Jan 31, 2017·8 cites·5 claims
- 2284US10396044B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 27, 2019·5 cites·16 claims
- 2383US8581410B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 12, 2013·2 cites·7 claims
- 2482US8519590B2Magneto generator with multiple sets of three-phase windingsBABA SHINJI·Filed 2007·Granted Aug 27, 2013·11 cites·11 claims
- 2582US7094630B2Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surfaceRENESAS TECH CORP·Filed 2004·Granted Aug 22, 2006·23 cites·2 claims
- 2682US6429564B1Magneto generatorMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 6, 2002·29 cites·8 claims
- 2781US7319268B2Semiconductor device having capacitors for reducing power source noiseRENESAS TECH CORP·Filed 2007·Granted Jan 15, 2008·13 cites·6 claims
- 2880US5731631ASemiconductor device with tape automated bonding elementMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 24, 1998·64 cites·17 claims
- 2979US10304768B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·2 cites·5 claims
- 3079US6614140B2Magneto generatorMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 2, 2003·26 cites·10 claims
- 3178US9171791B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 27, 2015·3 cites·10 claims
- 3277US9349678B2Chip having a pillar electrode offset from the bonding padRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·3 cites·18 claims
- 3377US8575757B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Nov 5, 2013·1 cites·6 claims
- 3477US5565379AMethod of manufacturing a semiconductor device having a bump electrode by a proximity exposure methodMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 15, 1996·53 cites·6 claims
- 3576US10056323B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Aug 21, 2018·3 cites·13 claims
- 3671US6426877B1Semiconductor device incorporating module structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 30, 2002·22 cites·10 claims
- 3771US6317333B1Package construction of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 13, 2001·39 cites·5 claims
- 3870US8580620B2Method of manufacturing semiconductor deviceNAKAGAWA KAZUYUKI·Filed 2010·Granted Nov 12, 2013·3 cites·12 claims
- 3969US5753973AResin seal semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1997·Granted May 19, 1998·28 cites·25 claims
- 4068US11049806B2Semiconductor device including semiconductor chip transmitting signals at high speedRENESAS ELECTRONICS CORP·Filed 2019·Granted Jun 29, 2021·1 cites·15 claims
- 4168US9818679B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 14, 2017·1 cites·16 claims
- 4268US9299681B2Semiconductor device and method of manufacturingRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·3 claims
- 4367US9293405B2Semiconductor deviceBABA SHINJI·Filed 2011·Granted Mar 22, 2016·2 cites·19 claims
- 4466US10283444B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted May 7, 2019·0 cites·7 claims
- 4566US6597582B2Semiconductor device incorporating module structureMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 22, 2003·17 cites·6 claims
- 4664US9735637B2Magnet-type rotating electric machineMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Aug 15, 2017·2 cites·9 claims
- 4764US9496153B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 15, 2016·0 cites·3 claims
- 4864US9171814B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 27, 2015·1 cites·8 claims
- 4963US8963327B2Semiconductor device including wiring board with semiconductor chipRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 24, 2015·1 cites·16 claims
- 5060US7508105B2Magneto-generatorMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Mar 24, 2009·9 cites·2 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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