Inventor · disambiguated record
Gordon Fisher
Also filed as: FISHER GORDON · FISHER GORDON L · FISHER GORDON LLOYD
21 granted patents·639 citations·filing 1973–1998
96Inventor score
Top patents by PatentIndex Score
21 records- 0196US5252196ACopper electroplating solutions and processesSHIPLEY CO·Filed 1991·Granted Oct 12, 1993·134 cites·46 claims
- 0290US4917774AMethod for analyzing additive concentrationSHIPLEY CO·Filed 1986·Granted Apr 17, 1990·69 cites·12 claims
- 0389US5223118AMethod for analyzing organic additives in an electroplating bathSHIPLEY CO·Filed 1991·Granted Jun 29, 1993·94 cites·19 claims
- 0485US5051154AAdditive for acid-copper electroplating baths to increase throwing powerSHIPLEY CO·Filed 1990·Granted Sep 24, 1991·67 cites·60 claims
- 0581US5513805AFiber separation method and apparatusFiled 1995·Granted May 7, 1996·59 cites·19 claims
- 0673US4917777AMethod for analyzing additive concentrationSHIPLEY CO·Filed 1988·Granted Apr 17, 1990·33 cites·8 claims
- 0773US3943048APowder anodeINT NICKEL CO·Filed 1973·Granted Mar 9, 1976·18 cites·14 claims
- 0872US4328076AElectrode and sludge collector support device and electroplating therewithINT NICKEL CO·Filed 1980·Granted May 4, 1982·19 cites·8 claims
- 0969US4932518AMethod and apparatus for determining throwing power of an electroplating solutionSHIPLEY CO·Filed 1989·Granted Jun 12, 1990·25 cites·10 claims
- 1069US4040915AMethod for producing regular electronickel or S nickel rounds from electroplating baths giving highly stressed depositsINT NICKEL CO·Filed 1976·Granted Aug 9, 1977·14 cites·7 claims
- 1164US5004525ACopper electroplating compositionSHIPLEY CO·Filed 1989·Granted Apr 2, 1991·12 cites·4 claims
- 1263US4897165AElectroplating composition and process for plating through holes in printed circuit boardsSHIPLEY CO·Filed 1988·Granted Jan 30, 1990·21 cites·16 claims
- 1362US5316150AFiber separation processFISHER GORDON·Filed 1993·Granted May 31, 1994·16 cites·18 claims
- 1461US4260470AInsoluble anode for electrowinning metalsINT NICKEL CO·Filed 1979·Granted Apr 7, 1981·10 cites·5 claims
- 1550US5800739AStabilized dispersions of graphite particlesSHIPLEY CO LLC·Filed 1996·Granted Sep 1, 1998·11 cites·10 claims
- 1643US6039859AMethod for electroplating using stabilized dispersions of conductive particlesSHIPLEY CO LLC·Filed 1998·Granted Mar 21, 2000·7 cites·9 claims
- 1743US5667662AElectroplating process and compositionSHIPLEY CO LLC·Filed 1996·Granted Sep 16, 1997·11 cites·9 claims
- 1843US4119501AElectroplating nickel using anodes of flattened nickel formsINT NICKEL CO·Filed 1977·Granted Oct 10, 1978·5 cites·8 claims
- 1938US4147597AMethod for producing electrolytic nickel in particulate forms under condition of high and variable internal stressINT NICKEL CO·Filed 1978·Granted Apr 3, 1979·5 cites·5 claims
- 2037US5419829AElectroplating processROHM & HAAS·Filed 1994·Granted May 30, 1995·6 cites·22 claims
- 2133US5395652APlating catalyst formed from noble metal ions and bromide ionsSHIPLEY CO·Filed 1994·Granted Mar 7, 1995·3 cites·20 claims
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