Inventor · disambiguated record
Hyun Sung Min
Also filed as: MIN HYUN SUNG
6 granted patents·1 pending application·8 citations·filing 1999–2018
71Inventor score
Top patents by PatentIndex Score
7 records- 0174US9278505B2Thermosetting resin composition and prepreg and metal clad laminate using the sameSHIM HEE-YONG·Filed 2012·Granted Mar 8, 2016·5 cites·8 claims
- 0270US10294341B2Thermosetting resin composition for semiconductor package and prepreg using the sameLG CHEMICAL LTD·Filed 2016·Granted May 21, 2019·2 cites·12 claims
- 0365US11091630B2Resin composition for semiconductor package, prepreg, and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Aug 17, 2021·1 cites·14 claims
- 0462US10913849B2Resin composition for semiconductor package, and prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Feb 9, 2021·0 cites·13 claims
- 0549US11535750B2Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2014·Granted Dec 27, 2022·0 cites·8 claims
- 0638US11214677B2Resin composition for semiconductor package, prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Jan 4, 2022·0 cites·11 claims
- 0727US2002147283A1Process for preparing toughened thermosetting structural materialsFiled 1999·Application pending·0 cites
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