Inventor · disambiguated record
Kyonghwan Koh
Also filed as: KOH KYONGHWAN
3 granted patents·3 pending applications·0 citations·filing 2021–2025
42Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0165US2025253163A1Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0262US12308253B2Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0358US2025149494A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0457US2025226285A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0555US11508713B2Methods of manufacturing semiconductor package and package-on-packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 0654US12400970B2Semiconductor package including electromagnetic shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →