Inventor · disambiguated record
Kunihiko Nishimura
Also filed as: NISHIMURA KUNIHIKO
15 granted patents·12 pending applications·29 citations·filing 2003–2022
88Inventor score
Top patents by PatentIndex Score
27 records- 0189US9051976B2Driving force transmission deviceKUWAHARA TAKASHI·Filed 2011·Granted Jun 9, 2015·12 cites·4 claims
- 0282US11107685B2Semiconductor manufacturing method and semiconductor manufacturing deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Aug 31, 2021·4 cites·9 claims
- 0371US8039396B2Method for manufacturing photovoltaic deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Oct 18, 2011·2 cites·12 claims
- 0469US2014308775A1Photovoltaic power device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 0567US8652869B2Method for roughening substrate surface and method for manufacturing photovoltaic deviceNISHIMURA KUNIHIKO·Filed 2009·Granted Feb 18, 2014·3 cites·8 claims
- 0665US7399214B2Method of manufacturing electron emission sourceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jul 15, 2008·1 cites·5 claims
- 0764US8012787B2Photovoltaic device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Sep 6, 2011·1 cites·8 claims
- 0859US7064479B2Cold cathode display device and method of manufacturing cold cathode display deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 20, 2006·4 cites·9 claims
- 0958US8835333B2Heat treatment method of semiconductor wafers, manufacturing method of solar battery, and heat treatment deviceOTA NARIHITO·Filed 2012·Granted Sep 16, 2014·2 cites·12 claims
- 1057US2011036402A1Photovoltaic power device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 1155US12512648B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 30, 2025·0 cites·8 claims
- 1249US2025380446A1Nitride semiconductor device and method of manufacturing nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1348US2024258195A1Bonded body comprising mosaic diamond wafer and semiconductor of different type, method for producing same, and mosaic diamond wafer for use in bonded body with semiconductor of different typeAIST·Filed 2022·Application pending·0 cites
- 1447US12494404B2Semiconductor device including stop islands and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 9, 2025·0 cites·14 claims
- 1547US12269107B2Method for manufacturing composite substrate, and composite substrateMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 8, 2025·0 cites·12 claims
- 1647US8767786B2Laser processing apparatus, laser processing method, and manufacturing method of photovoltaic deviceKATSURA TOMOTAKA·Filed 2009·Granted Jul 1, 2014·0 cites·2 claims
- 1746US2023290635A1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1846US2024096968A1Nitride semiconductor device and method for manufacturing nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1945US11854856B2Method of manufacturing semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 26, 2023·0 cites·19 claims
- 2045US2024030055A1Method of manufacturing semiconductor substrate and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2143US2024234575A9Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2242US11961765B2Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrateMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 16, 2024·0 cites·10 claims
- 2342US2023120994A1Polishing method, and semiconductor substrate manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2442US2013109128A1Manufacturing method for photovoltaic power device and manufacturing apparatus for photovoltaic power deviceKATSURA TOMOTAKA·Filed 2010·Application pending·0 cites
- 2541US10622532B2Thermoelectric conversion module and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 14, 2020·0 cites·8 claims
- 2640US2012097239A1Method for roughening substrate surface, method for manufacturing photovoltaic device, and photovoltaic deviceSATO TAKEHIKO·Filed 2010·Application pending·0 cites
- 2734US2017330990A1Method for manufacturing photovoltaic deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Application pending·0 cites
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