Inventor · disambiguated record
Susmriti Das Mahapatra
Also filed as: DAS MAHAPATRA SUSMRITI
3 granted patents·1 pending application·2 citations·filing 2019–2024
53Inventor score
Technology areasH10W
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0177US12040246B2Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2020·Granted Jul 16, 2024·1 cites·15 claims
- 0269US2024332112A1Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 0365US12166004B2Solder thermal interface material (STIM) with dopantINTEL CORP·Filed 2019·Granted Dec 10, 2024·1 cites·20 claims
- 0447US11817369B2Lids for integrated circuit packages with solder thermal interface materialsINTEL CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
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