Inventor · disambiguated record
Fuqiang Xiao
Also filed as: XIAO FUQIANG
4 granted patents·1 pending application·17 citations·filing 2011–2024
68Inventor score
Files withWESTERN DIGITAL TECH INC2LU ZHONG1SANDISK INFORMATION TECH SHANGHAI CO LTD1SANDISK TECHNOLOGIES INC1
Top patents by PatentIndex Score
5 records- 0188US10177119B2Fan out semiconductor device including a plurality of semiconductor dieSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jan 8, 2019·6 cites·20 claims
- 0282US9704797B2Waterfall wire bondingLU ZHONG·Filed 2011·Granted Jul 11, 2017·11 cites·11 claims
- 0362US12051660B2Wire bond pad design for compact stacked-die packageWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 0454US11189582B2Wire bond pad design for compact stacked-die packageWESTERN DIGITAL TECH INC·Filed 2019·Granted Nov 30, 2021·0 cites·11 claims
- 0553US2025233102A1Wire bonding machine having a rotatable capillary to secure a bond wire to a connection pointSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →