Inventor · disambiguated record
Paul J. Hundt
Also filed as: HUNDT PAUL J · HUNDT PAUL JOSEPH
8 granted patents·3 pending applications·323 citations·filing 1994–2011
89Inventor score
Top patents by PatentIndex Score
11 records- 0195US7956456B2Thermal interface material design for enhanced thermal performance and improved package structural integrityTEXAS INSTRUMENTS INC·Filed 2008·Granted Jun 7, 2011·37 cites·7 claims
- 0292US5458716AMethods for manufacturing a thermally enhanced molded cavity package having a parallel lidTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 17, 1995·136 cites·10 claims
- 0388US8272763B1LED luminaireCHINNAM SOLOMON RAJU S·Filed 2010·Granted Sep 25, 2012·81 cites·20 claims
- 0476US5650915AThermally enhanced molded cavity package having a parallel lidTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 22, 1997·45 cites·14 claims
- 0561US8304897B2Thermal interface material design for enhanced thermal performance and improved package structural integrityGURRUM SIVA PRAKASH·Filed 2011·Granted Nov 6, 2012·1 cites·14 claims
- 0659US7462783B2Semiconductor package having a grid array of pin-attached ballsTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 9, 2008·9 cites·10 claims
- 0747US2009061566A1Semiconductor package having a grid array of pin-attached ballsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 0843US2003136394A1Dicing saw having an annularly supported dicing bladeTEXAS INSTRUMENTS INC·Filed 2002·Application pending·0 cites
- 0938US6226452B1Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packagingTEXAS INSTRUMENTS INC·Filed 1998·Granted May 1, 2001·8 cites·12 claims
- 1032US2004007780A1Particle-filled semiconductor attachment materialFiled 2002·Application pending·0 cites
- 1131US5661900AMethod of fabricating an ultrasonically welded plastic support ringTEXAS INSTRUMENTS INC·Filed 1994·Granted Sep 2, 1997·6 cites·12 claims
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