Inventor · disambiguated record
Mohit Mamodia
Also filed as: MAMODIA MOHIT
15 granted patents·3 pending applications·32 citations·filing 2009–2020
88Inventor score
Top patents by PatentIndex Score
18 records- 0189US8786066B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Jul 22, 2014·11 cites·36 claims
- 0287US8466559B2Forming die backside coating structures with coreless packagesMANEPALLI RAHUL N·Filed 2010·Granted Jun 18, 2013·9 cites·17 claims
- 0374US8227551B2Polymeric compositions, methods of manufacture thereof and articles comprising the sameLESSER ALAN JAMES·Filed 2009·Granted Jul 24, 2012·5 cites·37 claims
- 0473US8287996B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2009·Granted Oct 16, 2012·5 cites·11 claims
- 0570US10957656B2Integrated circuit packages with patterned protective materialINTEL CORP·Filed 2017·Granted Mar 23, 2021·2 cites·13 claims
- 0665US11340258B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 0754US10598696B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2016·Granted Mar 24, 2020·0 cites·20 claims
- 0853US9793151B2Stiffener tape for electronic assemblyINTEL CORP·Filed 2014·Granted Oct 17, 2017·0 cites·16 claims
- 0953US9406618B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameINTEL CORP·Filed 2014·Granted Aug 2, 2016·0 cites·32 claims
- 1052US9165914B2Forming die backside coating structures with coreless packagesINTEL CORP·Filed 2013·Granted Oct 20, 2015·0 cites·12 claims
- 1151US10499461B2Thermal head with a thermal barrier for integrated circuit die processingINTEL CORP·Filed 2015·Granted Dec 3, 2019·0 cites·13 claims
- 1251US8569108B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2012·Granted Oct 29, 2013·0 cites·7 claims
- 1350US2014327149A1Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2014·Application pending·0 cites
- 1446US10998275B2Package with cathodic protection for corrosion mitigationINTEL CORP·Filed 2016·Granted May 4, 2021·0 cites·22 claims
- 1545US8304065B2Treatment for a microelectronic device and method of resisting damage to a microelectronic device using sameARANA LEONEL·Filed 2009·Granted Nov 6, 2012·0 cites·11 claims
- 1637US9698108B1Structures to mitigate contamination on a back side of a semiconductor substrateINTEL CORP·Filed 2015·Granted Jul 4, 2017·0 cites·24 claims
- 1736US2019206753A1Bicontinuous porous ceramic composite for semiconductor package applicationsINTEL CORP·Filed 2017·Application pending·0 cites
- 1833US2017140971A1Adhesive with tunable adhesion for handling ultra-thin waferRARAVIKAR NACHIKET R·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →