Inventor · disambiguated record
Yoshitsugu Matsuura
Also filed as: MATSUURA YOSHITSUGU
3 granted patents·7 pending applications·7 citations·filing 2005–2017
59Inventor score
Top patents by PatentIndex Score
10 records- 0190US10434750B2Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 8, 2019·5 cites·17 claims
- 0269US7947332B2Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 24, 2011·2 cites·14 claims
- 0351US2012244275A1Flexible laminate board, process for manufacture of the board, and flexible print wiring boardSUZUKI MASAHIKO·Filed 2012·Application pending·0 cites
- 0449US8501279B2Flexible laminate board, process for manufacturing of the board, and flexible print wiring boardSUZUKI MASAHIKO·Filed 2006·Granted Aug 6, 2013·0 cites·10 claims
- 0542US2010196703A1Adhesive sheetMATSUURA YOSHITSUGU·Filed 2008·Application pending·0 cites
- 0638US2020071488A1Composition, adhesive, sintered body, joined body, and method of producing joined bodyHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0737US2020063008A1Composition, adhesive, sintered body, joined body, and method of producing joined bodyHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0834US2014093723A1Substrate, method for producing same, heat-releasing substrate, and heat-releasing moduleTAKEUCHI MASAKI·Filed 2012·Application pending·0 cites
- 0930US2019300651A1Composition, adhesive, sintered body, joined body, and method of producing joined bodyHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1030US2020071569A1Method of producing joined body, composition for transient liquid phase sintering, sintered body, and joined bodyHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
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