Inventor · disambiguated record
Chin-Chiang Chang
Also filed as: CHANG CHIN-CHIANG
8 granted patents·3 pending applications·32 citations·filing 2013–2025
81Inventor score
Top patents by PatentIndex Score
11 records- 0190US9837595B2Semiconductor package assembly with thermal recycling functionMEDIATEK INC·Filed 2015·Granted Dec 5, 2017·8 cites·18 claims
- 0290US9319616B2Control method of an audio/video systemAMTRAN TECHNOLOGY CO LTD·Filed 2013·Granted Apr 19, 2016·16 cites·16 claims
- 0384US11264309B2Multi-row QFN semiconductor packageMEDIATEK INC·Filed 2020·Granted Mar 1, 2022·2 cites·18 claims
- 0478US2024388288A1Cmos schmitt trigger receiver for thin oxide technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0576US9905515B2Integrated circuit stress releasing structureMEDIATEK INC·Filed 2015·Granted Feb 27, 2018·3 cites·7 claims
- 0673US10037936B2Semiconductor package with coated bonding wires and fabrication method thereofMEDIATEK INC·Filed 2016·Granted Jul 31, 2018·2 cites·9 claims
- 0764US8743293B1Control method of an audio/video systemAMTRAN TECHNOLOGY CO LTD·Filed 2013·Granted Jun 3, 2014·1 cites·17 claims
- 0857US12230562B2Three-dimensional pad structure and interconnection structure for electronic devicesMEDIATEK INC·Filed 2022·Granted Feb 18, 2025·0 cites·27 claims
- 0955US11869831B2Semiconductor package with improved board level reliabilityMEDIATEK INC·Filed 2021·Granted Jan 9, 2024·0 cites·16 claims
- 1054US2024006278A1Multi-die qfn hybrid packageMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1152US2025329618A1Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2025·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →