Inventor · disambiguated record
Keiichi Okabe
Also filed as: OKABE KEIICHI
12 granted patents·2 pending applications·215 citations·filing 1999–2020
91Inventor score
Files withSHINETSU HANDOTAI KK7NIPPON TELEGRAPH & TELEPHONE3OKABE KEIICHI2PANASONIC CORP1SHIN ETSU HANDOTAI CO LDT1
Top patents by PatentIndex Score
14 records- 0191US7727860B2Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded waferSHINETSU HANDOTAI KK·Filed 2006·Granted Jun 1, 2010·21 cites·22 claims
- 0287US6583029B2Production method for silicon wafer and SOI wafer, and SOI waferSHINETSU HANDOTAI KK·Filed 2001·Granted Jun 24, 2003·60 cites·23 claims
- 0377USD584355SElectronic penPANASONIC CORP·Filed 2007·Granted Jan 6, 2009·24 cites·1 claims
- 0476US6491836B1Semiconductor wafer and production method thereforSHINETSU HANDOTAI KK·Filed 1999·Granted Dec 10, 2002·52 cites·18 claims
- 0563US7810383B2Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor waferSHINETSU HANDOTAI KK·Filed 2006·Granted Oct 12, 2010·2 cites·20 claims
- 0662USD669533SElectronic whiteboardOKABE KEIICHI·Filed 2012·Granted Oct 23, 2012·13 cites·1 claims
- 0755US6284658B1Manufacturing process for semiconductor waferSHINETSU HANDOTAI KK·Filed 1999·Granted Sep 4, 2001·20 cites·4 claims
- 0850US6220928B1Surface grinding method and apparatus for thin plate workSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 24, 2001·14 cites·4 claims
- 0946US11468165B2Intrusion prevention device, intrusion prevention method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2018·Granted Oct 11, 2022·0 cites·8 claims
- 1043US11176252B2Intrusion prevention device, intrusion prevention method, and intrusion prevention programNIPPON TELEGRAPH & TELEPHONE·Filed 2017·Granted Nov 16, 2021·0 cites·6 claims
- 1140US9093498B2Method for manufacturing bonded waferOKABE KEIICHI·Filed 2006·Granted Jul 28, 2015·0 cites·2 claims
- 1240US6358117B1Processing method for a waferSHINETSU HANDOTAI KK·Filed 1999·Granted Mar 19, 2002·9 cites·12 claims
- 1340US2009233109A1Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding MachineSHIN ETSU HANDOTAI CO LDT·Filed 2006·Application pending·0 cites
- 1437US2023246929A1Packet collection system, packet integration analysis apparatus, packet collection method and programNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →