Inventor · disambiguated record
Thomas Neidhart
Also filed as: NEIDHART THOMAS · Neidhart Thomas Christian
21 granted patents·3 pending applications·39 citations·filing 2002–2023
92Inventor score
Files withINFINEON TECHNOLOGIES AG14INFINEON TECHNOLOGIES AUSTRIA AG4STECHER MATTHIAS2IRSIGLER PETER1NEIDHART THOMAS1
Top patents by PatentIndex Score
24 records- 0197US11183452B1Transfering informations across a high voltage gap using capacitive coupling with DTI integrated in silicon technologyINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 23, 2021·10 cites·27 claims
- 0288US8093677B2Semiconductor device and manufacturing methodSTECHER MATTHIAS·Filed 2009·Granted Jan 10, 2012·11 cites·17 claims
- 0382US10325804B2Method of wafer thinning and realizing backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·3 cites·22 claims
- 0477US11011409B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 18, 2021·1 cites·20 claims
- 0577US9917333B2Lithium ion battery, integrated circuit and method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 13, 2018·2 cites·20 claims
- 0676US12211785B2Transferring information across a high voltage gap using capacitive coupling with DTI integrated in silicon technologyINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jan 28, 2025·0 cites·27 claims
- 0775US9618693B2Liquid sensing systems and methods using a ring resonator sensorINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 11, 2017·2 cites·23 claims
- 0875US8895418B2Semiconductor device and method for producing a semiconductor deviceIRSIGLER PETER·Filed 2012·Granted Nov 25, 2014·4 cites·23 claims
- 0972US9960076B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 1, 2018·1 cites·29 claims
- 1071US8859409B2Semiconductor component comprising a dopant region in a semiconductor body and a method for producing a dopant region in a semiconductor bodyNEIDHART THOMAS·Filed 2012·Granted Oct 14, 2014·3 cites·16 claims
- 1169US11664307B2Transferring information across a high voltage gap using capacitive coupling with dti integrated in silicon technologyINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 1267US9412824B2Semiconductor component having a dopant region formed by a dopant composed of an oxygen/vacancy complexINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 9, 2016·1 cites·17 claims
- 1365US9903816B2Photonic crystal sensor structure and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 27, 2018·1 cites·24 claims
- 1464US10247671B2Photonic crystal sensor structure and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 2, 2019·0 cites·20 claims
- 1561US12107130B2Semiconductor device having semiconductor device elements in a semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 1, 2024·0 cites·16 claims
- 1660US10535553B2Devices with backside metal structures and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 14, 2020·0 cites·14 claims
- 1756US11038028B2Semiconductor device and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
- 1856US9613804B2Method of manufacturing semiconductor devices which allows reproducible thinning of a semiconductor body of the semiconductor devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Apr 4, 2017·0 cites·18 claims
- 1950US8183125B2Semiconductor device and manufacturing methodSTECHER MATTHIAS·Filed 2011·Granted May 22, 2012·0 cites·8 claims
- 2049US9306010B2Semiconductor arrangementSCHULZE HANS-JOACHIM·Filed 2012·Granted Apr 5, 2016·0 cites·21 claims
- 2148US9698247B2Method of producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 4, 2017·0 cites·8 claims
- 2244US2015294868A1Method of Manufacturing Semiconductor Devices Containing Chalcogen AtomsINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 2339US2018082882A1Wafer Chuck, Use of the Wafer Chuck and Method for Testing a Semiconductor WaferINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 2433US2003060014A1Field effect transistor configuration with high latch-up resistance, and method for its productionFiled 2002·Application pending·0 cites
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