Inventor · disambiguated record
Kyungseon Hwang
Also filed as: HWANG KYUNGSEON
5 granted patents·1 pending application·5 citations·filing 2016–2024
69Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0191US11769746B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0281US10211176B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·3 cites·13 claims
- 0362US11869878B2Semiconductor module including a semiconductor package connected to a module substrate and a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·14 claims
- 0457US10943881B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·10 claims
- 0556US11171119B2Semiconductor module including a semiconductor package connected to a module substrate and a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·10 claims
- 0656US2025293141A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →