Inventor · disambiguated record
Takeshi Negishi
Also filed as: NEGISHI TAKESHI
7 granted patents·5 pending applications·96 citations·filing 1989–2014
83Inventor score
Top patents by PatentIndex Score
12 records- 0190US7532481B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialMITSUBISHI MATERIALS CORP·Filed 2005·Granted May 12, 2009·17 cites·6 claims
- 0286US6563709B2Liquid-cooled heat sink and manufacturing method thereofMITSUBISHI MATERIALS CORP·Filed 2001·Granted May 13, 2003·58 cites·9 claims
- 0380US8164909B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialNAGASE TOSHIYUKI·Filed 2010·Granted Apr 24, 2012·6 cites·3 claims
- 0456US9503893B2Communication management system, relay device, communication control system, communication system, communication method, and recording medium storing communication control programNEGISHI TAKESHI·Filed 2014·Granted Nov 22, 2016·1 cites·19 claims
- 0552US2008248326A1Ai/ain joint material, base plate for power module, power module, and manufacturing method of ai/ain joint materialMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 0648US8188376B2Insulation substrate, power module substrate, manufacturing method thereof, and power module using the sameNEGISHI TAKESHI·Filed 2009·Granted May 29, 2012·0 cites·5 claims
- 0746US8001682B2Insulation substrate, power module substrate, manufacturing method thereof, and power module using the sameMITSUBISHI MATERIALS CORP·Filed 2005·Granted Aug 23, 2011·0 cites·4 claims
- 0846US5051989ASwitching arrangement capable of switching burst time plan tables/channel assignment pattern tables of a specific terrestrial stationNEC CORP·Filed 1989·Granted Sep 24, 1991·14 cites·4 claims
- 0940US2007235246A1Vehicle Steering System And Assembling Method ThereofKAWAIKE YUJI·Filed 2005·Application pending·0 cites
- 1040US2006196237A1Steering lock deviceHIBINO TADASHI·Filed 2004·Application pending·0 cites
- 1137US2004188828A1Heat-conducting multilayer substrate and power module substrateMITSUBISHI MATERIALS CORP·Filed 2003·Application pending·0 cites
- 1235US2002157494A1Connection structure of extendable shaftFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →