Inventor · disambiguated record
Ja Uk Koo
Also filed as: KOO JA-UK
2 granted patents·1 pending application·40 citations·filing 2004–2024
56Inventor score
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3 records- 0176US7115446B2Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the sameKOO JA UK·Filed 2004·Granted Oct 3, 2006·40 cites·22 claims
- 0265US11786965B1Motor plate type coil forming apparatusHYUNDAI MOTOR CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·17 claims
- 0354US2025300530A1Device and method for manufacturing rotor for induction motorHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →