Inventor · disambiguated record
Ja-Eung Koo
Also filed as: KOO JA-EUNG
14 granted patents·6 pending applications·65 citations·filing 2003–2022
89Inventor score
Top patents by PatentIndex Score
20 records- 0185US10032890B2Method of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·7 cites·20 claims
- 0279US7166019B2Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 23, 2007·14 cites·20 claims
- 0377US7348277B2Methods of fabricating semiconductor device using sacrificial layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 25, 2008·8 cites·14 claims
- 0475US10056466B2Methods for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 21, 2018·3 cites·20 claims
- 0573US6924207B2Method of fabricating a metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 2, 2005·18 cites·20 claims
- 0670US10910266B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·13 claims
- 0770US9870950B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 16, 2018·2 cites·20 claims
- 0868US6976902B2Chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 20, 2005·12 cites·20 claims
- 0961US11361995B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 1057US11648644B2Polishing pad conditioning apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 16, 2023·0 cites·17 claims
- 1156US12426305B2Semiconductor device including transistor having source/drain contract with convex curved surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·17 claims
- 1249US11189572B2Maintaining height of alignment key in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 1349US2007178644A1Semiconductor device having an insulating layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1446US2006151887A1Interconnection structure having double diffusion barrier layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1544US2008045018A1Method of chemical-mechanical polishing and method of forming isolation layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1644US2008132030A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1742US2007128991A1Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the sameYOON IL-YOUNG·Filed 2006·Application pending·0 cites
- 1840US7595253B2Method of forming the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 29, 2009·0 cites·11 claims
- 1938US11791173B2Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·15 claims
- 2032US2008081406A1Method of Fabricating Semiconductor Device Having Dual Stress LinerCHOO JAE-OUK·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →